Samsung Electronics Co., Ltd.

Cheol-ha Lee

Jong-Doo Joo

Tae-Seong Kim

Jung-han Kim

Young-ju Choi

A fuse memory comprising a discharge circuit is provided. The fuse memory includes a fuse cell array comprising fuse cells connected to read word lines, programs word lines, and bit lines arranged in rows and columns; and at least one discharge circuit arranged in each of the rows. The discharge circuit discharges a voltage level of a program word line of the fuse cells selected in a read mode to a ground voltage.

Fuse memory having discharge circuit

A driving integrated circuit and methods thereof are provided. The driving IC includes a memory for driving a display panel and having a memory structure including at least one cell block, a scan register receiving data read from the memory, a source driver receiving data output from the scan register and outputting the received latched data to the panel and a switching unit establishing a connection between an activated cell block and the scan register in response to an activation of the activated cell block. One method includes performing a read operation to read data from a memory, the read operation including sensing and amplifying data stored within a memory cell, turning on a switch to increase a bit line voltage above a voltage threshold and latching the amplified data received through a line connected to the switch and transmitting the read data to the panel of the display device.

Driving integrated circuit and methods thereof

A semiconductor memory device includes a memory core and an input/output circuit. The memory core amplifies a signal of a memory cell to output the amplified signal through an input/output line pair in a read mode, receives a signal of the input/output line pair to store in the memory cell in a write mode, and electrically separates a bit line pair from the input/output line pair in response to a read column selection signal, a write column selection signal and a first data masking signal. The input/output circuit buffers and provided a signal of the input/output line pair to input/output pins, receives input data from the input/output pins, and buffers the received input data to provide the buffered input data to the input/output line pair. Thus, the semiconductor device can perform a fast data writing operation.

Semiconductor memory device of controlling bit line sense amplifier

An embedded memory and methods thereof are provided. The example embedded memory may include a first memory block configured to output data, selected by a first column select signal, on a first scan output line if the first memory block is determined to be non-defective and a second memory block configured to output data, selected by a second column select signal on a second scan output line if the first memory block is determined to be non-defective, the second memory block further configured to output data, selected by the first column select signal, on the first scan output line if the first memory block is determined to be defective. A first example method may include performing a memory scan on a plurality of cell arrays, determining whether at least one of a plurality of cell arrays is defective based on the results of the memory scan, receiving data to be stored in a first cell array of the plurality of cell arrays, storing the received data in the first cell array if the determining determines the first cell array not to be defective and storing the received data in a second cell array, if the determining determines the first cell array to be defective. A second example method may include retrieving data from an embedded memory, including receiving data on a first scan output line from a first cell array, included among a plurality of cell arrays, if the first cell array is not defective and receiving data on the first scan line from a second cell array if the first cell array is defective.

Embedded memory and methods thereof

Integrated circuit memory devices include a stress voltage generator that generates a stress voltage that is higher than the internal supply voltage of the integrated circuit memory device and that applies the stress voltage to the memory cell array during the stress BIST of the memory cell array. The stress voltage generator is preferably responsive to a BIST request signal and to a stress test signal that are applied from external of the integrated circuit memory device, to apply the stress voltage to the memory cell array and to perform a BIST of the memory cell array. The stress voltage generator is responsive to the BIST request signal and absence of the stress test signal, to apply the internal supply voltage to the memory cell array and to perform a BIST of the memory cell array. Accordingly, circuits within the integrated circuit memory device can be responsive to external test signals to generate stress voltages during BIST.

Growing community of inventors

Suwon-si, South Korea

Cheol-ha Lee