Wuhan University

Chenyuan Wang

Yigang He

Lie Li

Liulu He

Chuankun Wang

Hui Zhang

Bolun Du

A method and a system for comprehensively evaluating reliability of a multi-chip parallel IGBT module are provided. The method includes: establishing a gate-emitter voltage reliability model of the multi-chip parallel IGBT module, performing a chip fatigue failure test, and selecting a gate-emitter voltage as a failure characteristic quantity; establishing a transconductance reliability model of the multi-chip parallel IGBT module, performing a bonding wire shedding failure test, and selecting a transmission characteristic curve of the module as a failure characteristic quantity; using a Pearson correlation coefficient to characterize a degree of health of the IGBT module, and respectively calculating degrees of health PPMCCand PPMCCin different degrees of chip fatigue and bonding wire shedding failure states; and comprehensively evaluating the reliability of the multi-chip parallel IGBT module according to PPMCCand PPMCC.

Method and system for comprehensively evaluating reliability of multi-chip parallel IGBT module

A reliability evaluation method and system for a microgrid inverter IGBT based on segmented long short-term memory (LSTM) is disclosed, including steps as follows. An electrothermal coupling model is constructed to obtain real-time junction temperature data. The original LSTM algorithm is improved to obtain a segmented LSTM prediction network for the aging characteristics of the IGBT. The monitoring value of the IGBT aging parameter is used to perform segmented LSTM prediction to obtain the predicted aging process, and the threshold values of different aging stages are categorized. An aging correction is performed on the aging parameter of the electrothermal coupling model to ensure the accuracy of the junction temperature data. Rainflow-counting algorithm is used to calculate real-time thermal stress load distribution of the IGBT. The fatigue damage theory and the Lesit life prediction model are combined to calculate the real-time cumulative damage and predicted life of the IGBT.

Reliability evaluation method and system of microgrid inverter IGBT based on segmented LSTM

A serial IGBT voltage equalization method and system based on an auxiliary voltage source is disclosed. The method includes the following steps. (1) Detect a port dynamic voltage of each serial IGBT. (2) Perform dynamic overvoltage diagnosis respectively on the port dynamic voltage of each IGBT. (3) Supply emergency high level signal to the gate of the IGBT when there is dynamic overvoltage. (4) Stop supplying emergency high level signal to the gate of the IGBT, supply a constant voltage at the gate of the IGBT through the auxiliary voltage source. The invention provides a constant voltage through the auxiliary voltage source, prolongs the off time of the faulty IGBT, and turns off other IGBTs simultaneously, thereby achieving the purpose of serial IGBT voltage equalization.

Serial IGBT voltage equalization method and system based on auxiliary voltage source

The disclosure discloses a multi-time-scale reliability evaluation method of a wind power IGBT considering fatigue damage and a system thereof. Lifetime information of a power device is comprehensively extracted by using multiple time scales. An electro-thermal coupling model of an IGBT module is established to obtain a junction temperature data. A steady-state junction temperature database of the IGBT in different aging states is established. Based on a SCADA monitoring data, the junction temperature data is outputted in real-time through the electro-thermal coupling model and a real-time thermal stress cycle number is calculated in a short-term time-scale profile, and a wind speed probability distribution curve is obtained in a long-term time-scale profile. A maximum thermal stress cycle number that the IGBT can withstand in different aging stages is obtained in advance and a cumulative damage degree and an estimated lifetime of the IGBT of the wind power converter are calculated.

Multi-time-scale reliability evaluation method of wind power IGBT considering fatigue damage and system thereof

The disclosure discloses an IGBT module reliability evaluation method and device based on bonding wire degradation, which belong to the field of IGBT reliability evaluation. The realization of the method includes: obtaining a relationship between a IGBT chip conduction voltage drop Uand an operating current Ialong with a chip junction temperature T; for an IGBT module under test, obtaining the conduction voltage drop Uof the IGBT chip through the operating current Iand the chip junction temperature T; obtaining an external conduction voltage drop Uof the IGBT module by using a voltmeter; performing subtraction to obtain a voltage drop at a junction of a IGBT chip and a bonding wire, and combining the operating current to obtain a resistance at the junction; determining that the IGBT module has failed when the resistance at the junction increases to 5% of an equivalent impedance of the IGBT module.

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Hubei, China

Chenyuan Wang