Huawei Technologies Co., Limited

Chenyang He

Jie Sun

Ruiming Mo

An electronic element includes a substrate, a first input pad on a first surface of the substrate, at least one chip on the first surface of the substrate, and a first output pad on the first surface of the substrate. The first input pad, the at least one chip, and the first output pad are sequentially connected. The first input pad and the first output pad are in direct physical contact with the first surface of the substrate. A surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.

Growing community of inventors

Shanghai, China

Chenyang He