Cypress Semiconductor Corporation

Chenxi Huang

Yung Chen

Systems, methods, and devices for a ball grid array with non-linear conductive routing are described herein. Systems include a printed circuit board, a microprocessor, a ball grid array, and a substrate. The ball grid array includes a first solder ball and a second solder ball. The substrate includes a non-linear conductive routing electrically coupling the first solder ball and the second solder ball. The non-linear conductive routing includes a first routing section connected to the first solder ball, and a second routing section connected to the second solder ball. The non-linear conductive routing further includes a third routing section connected to the first routing section, and a fourth routing section connected to the third routing section, wherein each of the third routing section and the fourth routing section are rotational routing sections configured to flow current in a first rotational direction.

Compact routing package for high frequency isolation

An example voltage controlled oscillator includes an inductor, a capacitor coupled to the inductor, and a signal source coupled to the inductor and the capacitor to sustain an oscillating signal. The voltage controlled oscillator includes a first varactor coupled to the inductor and the capacitor, wherein the first varactor is biased by a first bias voltage and is configured to change a frequency of the oscillating signal based on a first control voltage signal. The voltage controlled oscillator includes a second varactor coupled to the inductor, the capacitor, and the first varactor, wherein the second varactor is biased by a second bias voltage and is configured to compensate temperature variation of the frequency of the oscillating signal over a plurality of frequency bands based on second control voltage signal.

Oscillator with frequency variation compensation

Systems, methods, and devices for a ball grid array with non-linear conductive routing are described herein. Such a ball grid array may include a plurality of solder balls that are electrically coupled by a non-linear conductive routing. The non-linear conductive routing may include a plurality of routing sections where each of the plurality of routing sections is disposed at an angle to adjacent routing sections.

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Chenxi Huang