Sj Semiconductor (Jiangyin) Corporation

Chentar Wu

Chengchung Lin

Yenheng Chen

A semiconductor package structure having an antenna module includes: a substrate, having a first surface and a second surface; a semiconductor chip, disposed on the first surface; a plastic packaging material layer, formed on the first surface, where the plastic packaging material layer wraps the semiconductor chip and exposes a part of a front surface of the semiconductor chip; a rewiring layer, disposed on the plastic packaging material layer and electrically connected to the semiconductor chip; a metal bump, electrically connected to the rewiring layer; and an antenna module, disposed on the second surface of the substrate.

Semiconductor package structure having antenna module

The present application provides a semiconductor packaging structure with an antenna assembly, including: a substrate with through-substrate-via holes; a rewiring layer, located on the substrate; metal bumps, located on and electrically connected to the rewiring layer; a semiconductor chip, located on a surface of the rewiring layer and electrically connected to the rewiring layer; a conductive column, filling in the via hole; a bottom filling layer filling up a gap between the semiconductor chip and the rewiring layer; a polymer layer surrounding the metal bumps and the semiconductor chip; and an antenna assembly, which is electrically connected to one metal bump through the conductive column and the rewiring layer. By using the foregoing solution, the rewiring layer and the metal bumps facilitate proper packaging design.

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Jiangyin, China

Chentar Wu