Nec Corporation

Chenpin Hsu

Hitoshi Sakamoto

Hisashi Ishida

Kenichiro Fukushi

Manabu Kusumoto

Yoshio Kameda

Takeo Nozaki

Provided are a reference scale and dimension measurement system that make it possible to maintain accurate measurement even if the reference scale is not disposed or projected on a measurement surface. A dimension measurement device according to the present invention is provided with: a reference scale extraction means for extracting, from photographed image data including a reference scale that includes a film that has a pattern for displaying a length reference formed on the surface thereof and a lens that is in contact with the film, an image in which an image of the length reference is formed on the basis of the relationship between a pattern function expressing the length reference projected onto the lens according to variation in a prescribed angle between the reference scale and the optical axis of a photography device and an image formation color function indicating the image of the length reference formed on the imaging device; an object of measurement extraction means for extracting an object of measurement image from photographed image data including the reference scale; and a dimension calculation means for calculating a dimension of the object of measurement on the basis of a dimension of the image in which the image of the length reference is formed and the image of the object of measurement.

Dimension measurement device, dimension measurement system, and dimension measurement method

A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the size of a semiconductor element. A fixing support point of a plate spring is provided at a center of this protruding surface, and the plate spring is fixed on all sides. Grounding pressure is applied via the single point provided by the fixing support point. As a result, any tilting of the heat-absorbing surface relative to the surface of the heat-generating element is kept to a minimum. Heat pipes are provided around the periphery such that they enclose the protruding area from the outside.

Cooling structure for an electronic component and electronic instrument

Growing community of inventors

Tokyo, Japan

Chenpin Hsu