Western Digital Technologies, Inc.

Chenlin Yang

Chin-Tien Chiu

Cong Zhang

Junrong Yan

Weili Wang

Xin Lu

Xiaofeng Di

Qi Deng

CheeKeong Chin

Chaur Yang Ng

A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Semiconductor device including vertical wire bonds

Growing community of inventors

Shanghai, China

Chenlin Yang