Acm Research (Shanghai) Inc.

Chenhua Lu

Jian Wang

Hui Wang

Zhaowei Jia

Hongchao Yang

Meng Wu

Quan Cao

Disclosed is a substrate processing method, which comprises the following steps: S: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.

Substrate processing method

A plating apparatus for depositing metal on a substrate, comprising a membrane frame (), a catholyte inlet pipe () and a center cap (). The membrane frame () has a center passage () which passes through the center of the membrane frame (). The catholyte inlet pipe () is connected to the center passage () of the membrane frame (). The center cap () is fixed at the center of the membrane frame () and covers over the center passage () of the membrane frame (). The top of the center cap () has a plurality of first holes (). The catholyte inlet pipe () supplies catholyte to the center cap () through the center passage () of the membrane frame (), and the catholyte is supplied to a center area of the substrate through the first holes () of the center cap ().

Plating apparatus

Growing community of inventors

Shanghai, China

Chenhua Lu