Lsi Logic Corporation

Lsi Corporation

Chengyu Guo

Wee Keong Liew

Hong Tee Lim

Qwai Hoong Low

A wire bond design integrated circuit with a substrate having a front side and an opposing back side. Circuitry is disposed on the font side. Electrically conductive vias are disposed through the substrate from the front side to the back side, and are electrically connected to the circuitry such that the electrically conductive vias provide power and ground services only for the circuitry. Bonding pads are disposed on the front side, and are electrically connected to the circuitry such that the bonding pads provide signal communication only for the circuitry.

Package with power and ground through via

A method of routing an integrated circuit package includes receiving as input a placement and routing of at least a portion of an integrated circuit package design, selecting a set of at least three trace segments from the placement and routing that includes at least one inner trace segment routed between two outer trace segments, calculating an inner line function for the inner trace segment that is equally spaced from one of an adjacent line function, an adjacent outer line function, and an adjacent outer trace segment on each side of the inner line function, calculating a pair of end points for the inner line function, and generating as output a new routing that reroutes the inner trace segment collinearly with the inner line function and terminates the inner trace segment by the pair of end points.

Method and computer program for spreading trace segments in an integrated circuit package design

A BGA package having a multiplicity of power segments configured for power connection to integrated circuit die is disclosed. The BGA package substrate includes an integrated circuit die and a ground ring. The substrate also includes a first power ring with a plurality of spaced apart first power ring segments arranged around the die. A second power ring having a plurality of spaced apart conductive second ring segments is also formed around the die. A plurality of vias that penetrate through the substrate are provided to accommodate electrical connections to the segments of the first and second power rings and to the ground ring. The package includes bonding wires for connecting the die to the first and second ring segments and ground ring. Additionally, the package is commonly encapsulated to protect the die and wires. In some implementations, the conductive first ring segments are arranged in staggered configuration relative to the conductive second ring segments with each of the first ring segments having a conductive tab configured so that it passes through spaces between the conductive second ring segments. The tabs electrically connecting the first ring segments to vias.

Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die

A two layer PBGA which includes a metal ground plane at its bottom layer. The ground plane is preferably a metal plane which is connected to ground through a metal connection to a ball pad at the center of the package and a ball pad proximate the edge of the package. The ground plane is voided around the signal and power balls, via and &ldquo;dog bones&rdquo;. The PBGA is configured such that the ground plane serves effectively the same function as the second layer ground plane in a conventional four layer PBGA. The PBGA provides a cheaper alternative to the generally more expensive four layer PBGA, and provides better cross talk performance (especially for high frequency signaling) as well as better thermal performance as a result of having more metal at the bottom layer of the package.

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Saratoga, CA, United States of America

Chengyu Guo