Data Storage Institute

Agency for Science, Technology and Research

Chengwu An

Minghui Hong

Yong Feng Lu

Wen Dong Song

Kaidong Ye

Yongfeng Lu

A method and apparatus for testing a magnetic medium. The method comprises applying a magnetic field of a time-varying strength; directing a polarized optical beam towards a portion of the medium that is in the magnetic field, wherein the optical beam is reflected by a surface of the medium at a point of incidence in the magnetic field; moving the medium relative to the optical beam so as to cause the point of incidence to repeatedly traverse each of a plurality of sectors along a track on the surface; obtaining a series of Kerr signal measurements of the reflected optical beam; grouping measurements into ensembles such that the measurements in an individual ensemble are those obtained while the point of incidence was in a corresponding one of the sectors; and determining at least one magnetic property of at least one of the sectors from the measurements in the corresponding ensemble.

Method and apparatus for testing magnetic properties of magnetic media

This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. COlaser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after COlaser deflashing. COlaser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

Method and apparatus for deflashing of integrated circuit packages

The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.

Growing community of inventors

Singapore, Singapore

Chengwu An