Potomac Photonics, Inc.

Parelec, Inc.

Chengping Zhang

Michael T Duignan

David Liu

Paul Harriman Kydd

Scott A Mathews

Christopher J Wargo

Susan Gordon, Legal Representative

Todd A Kegresse

A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.

Passive component assembly for multi-layer modular electrical circuit

A method of forming high resolution electronic circuits () on a substrate () is provided. The method includes the steps of laminating a dielectric layer () on a substrate (), laser drilling channels (and) in the dielectric film () and the substrate (), and filling channels (and) with a filler material (). Further, a release layer () is applied to dielectric film layer () and filler material (), the release layer () having an adhesive thereon. Release layer () is peeled or otherwise removed from substrate (), leaving filler material () formed and shaped on substrate (), thus producing a high resolution electronic circuit on substrate ().

Method of forming high resolution electronic circuits on a substrate

Method and components for manufacturing multi-layer modular electrical circuits

Growing community of inventors

Rockville, MD, United States of America

Chengping Zhang