Everdisplay Optronics (Shanghai) Limited

Other

Everdisplay Optronics (Shanghai) Co., Ltd.

Chengpei Huang

QiGuo Zhang

ChuWang Huang

Huanyu Huang

Jr-Hong Chen

Chuwan Huang

A flexible display device includes a flexible display panel and an adsorption layer including at least one rigid plane and the flexible display panel is adsorbed on the rigid plane to maintain flatness of the flexible display plane.

Flexible display device and method for operating the same

The present disclosure is related to display panels, especially to flexible electronic devices. By means of adding an inorganic membrane with surface roughness between a bonding layer and a PI film, in order to effectively improve the dimensional stability of plastic substrate and the water/oxygen barrier property of flexible substrate during the PI film fabrication and the follow-up process, improving the yield of good products and prolonging the working life thereof.

Flexible electronic devices

The present disclosure is related to a method of fabricating display panels, especially to a method of fabricating flexible electronic devices. By means of adding an inorganic membrane with surface roughness between a bonding layer and a PI film, in order to effectively improve the dimensional stability of plastic substrate and the water/oxygen barrier property of flexible substrate during the PI film fabrication and the follow-up process, improving the yield of good products and prolonging the working life thereof.

Method of fabricating flexible electronic devices

Provided herein is a flexible packaging substrate, comprising a first polymer layer; a metal foil layer disposed on the first polymer layer; a second polymer layer disposed on the metal foil layer; and wherein the surface area of the metal foil layer is larger than those of both the first and the second polymer layer. Also provided are a fabricating method for the same and a method for packaging an organic electroluminescent device using the same. The flexible packaging substrate according to the present invention is able to prevent oxygen and moisture from permeating effectively, allowing the service life of the packaged device prolonged. Additionally, the fabrication according to the examples of the present invention was performed through simple processes, and thereby the packaging process was simplified and the packaging performance was improved.

Growing community of inventors

Shanghai, China

Chengpei Huang