Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Chengnan Hsieh

Yu Yang

Wei Zhou

Giseub Lim

Chen Yuan

Lin Huang

Liang Yao

Liming Xu

Weigang Peng

Erlun Chen

A liquid knife cleaning apparatus and a liquid knife are provided. The liquid knife cleaning apparatus includes: a frame configured to be arranged on the liquid knife and be capable of reciprocating in an extending direction of the knife edge; a cleaning blade configured to extend into the knife edge of the liquid knife and be capable of reciprocating inside the knife edge under the driving of the frame to clean the knife edge, the cleaning blade being arranged on the frame; and a movable mechanism configured to control the frame to reciprocate on the liquid knife in the extending direction of the knife edge, the frame being connected to the movable mechanism.

Liquid knife, liquid knife cleaning apparatus and liquid knife assembly apparatus

Provided is a substrate processing apparatus, which comprises a processing chamber, a substrate sensing assembly, a rotation shaft and a driving assembly. A portion of the rotation shaft is provided inside the processing chamber and the remaining portion thereof is provided outside the processing chamber. The substrate sensing assembly is provided on the portion of the rotation shaft outside the processing chamber. The driving assembly is fixed at the portion of the rotation shaft inside the processing chamber. The driving assembly drives, when coming into contact with the substrate, the rotation shaft to rotate about its own axis along a first direction, and drives, when the substrate comes into no contact with the driving assembly, the rotation shaft to rotate about its axis along a second direction opposite to the first direction. The treatment liquid does not affect the substrate sensing assembly since it is provided outside the processing chamber.

Substrate processing apparatus

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Beijing, China

Chengnan Hsieh