Anhui Anuki Technologies Co., Ltd.

Anhui Yunta Electronic Technologies Co., Ltd

Chengjie Zuo

Jun He

Xiaodong Wang

Chenggong He

Qilin Shi

Lei Xu

Jian Niu

Kun Qin

Wei Cheng

Provided are a band-pass filter circuit and a multiplexer. The band-pass filter circuit includes an electromagnetic LC filter circuit and acoustic resonance units. At least one of the acoustic resonance units each includes at least one first acoustic resonator and at least one second acoustic resonator. The first acoustic resonator is connected in series between the band-pass filter circuit and the electromagnetic LC filter circuit. Each of the at least one second acoustic resonator is connected to a terminal of the at least one first acoustic resonator, where the first terminal of the band-pass filter circuit serves as an input terminal or output terminal of the band-pass filter circuit. One or more of the acoustic resonance units are connected on an input side of the electromagnetic LC filter circuit; and the remaining of the acoustic resonance units are connected on an output side of the electromagnetic LC filter circuit.

Band-pass filter circuit and multiplexer

Provided are a 3D filter circuit and a 3D filter. The 3D filter circuit includes a multilayer structure. The multilayer structure includes at least two conductive layers and at least one organic dielectric layer. Each organic dielectric layer is disposed between different conductive layers. The multilayer structure is configured to form at least one capacitor.

3D filter circuit and 3D filter

Provided are an antenna assembly and a communication system, relating to the technical field of antennas. The antenna assembly comprises a filter module and an antenna module, wherein the antenna module is connected to the filter module, and the antenna module is integrated with the filter module, wherein an output impedance of the filter module is matched with an input impedance of the antenna module.

Antenna assembly and communication system

The present disclosure provides a filter circuit and an electronic device, and relates to the field of filters. The filter circuit can include a filter and a suppression ring, the suppression ring can be arranged around a periphery of the filter, the filter can include several grounded ports, each of grounded ports can be electrically connected to the suppression ring, and each of grounded ports can be grounded. The out-of-band rejection capability of the filter can be greatly improved by providing the suppression ring on the periphery of the filter and connecting each of grounded ports to the suppression ring before grounding.

Filter circuit and electronic device

Provided are tuning circuit and communication device. The tuning circuit includes tuning switch, ground patch point, and at least two sets of patch units. Each set of patch units at least includes a first patch point and a second patch point; the tuning switch comprises a standard port and at least one conversion port, and each set of patch units is connected to the corresponding conversion port; a first end of a first patch point and a first end of a second patch point in the same set of patch units are connected to the same conversion port; second ends of first patch points in different patch units are respectively connected to different contact points of an antenna; the second ends of all the second patch points are connected to the ground; and both ends of the ground patch point are respectively connected to the standard port and the ground.

Tuning circuit and communication device

Provided are balun circuit structure and balun device, the balun circuit structure comprises unbalanced terminal, first and second balanced terminals, grounded power terminal, first, second, third and fourth inductors. The first terminal of the first inductor is connected to the first terminal of the second inductor, the second terminal of the first inductor is connected to the unbalanced terminal, the second terminal of the second inductor is open-circuited, the first terminal of the third inductor and the first terminal of the fourth inductor are connected to the grounded power terminal, the second terminal of the third inductor is connected to the first balanced terminal, the second terminal of the fourth inductor is connected to the second balanced terminal, the first, second, third and fourth inductors are located in different planes, respectively, the first inductor is coupled to the third inductor, and the second inductor is coupled to the fourth inductor.

Balun circuit structure and balun device

Provided is a chip inductor and manufacturing method thereof. The chip inductor includes: a pin layer, a plurality of insulating layers and a plurality of metal layers, where the insulating layers and the metal layers are arranged successively and alternately on the pin layer. Multiple patterned metal structures arranged in the plurality of metal layers are respectively electrically connected to form a multilayer plane spiral coil structure. The multilayer plane spiral coil structure has two ends electrically connected with respective pin structures in the pin layer.

Chip inductor and method for manufacturing same

Provided are a band-stop filter and a multi-frequency band-stop filter. The band-stop filter includes at least one band-stop filtering unit; the at least one band-stop filtering unit includes an input port, an output port, at least two resonators, and at least one inductive element; and the first terminal of the first resonator is connected between the input port and the inductive element, and the first terminal of the second resonator is connected between the output port and the inductive element.

Band-stop filter and multi-frequency band-stop filter

Provided by a bandpass filter circuit and a multiplexer. The bandpass filter circuit includes at least one electromagnetic LC filter circuit and at least one acoustic wave resonance unit. The at least one acoustic wave resonance unit includes an input port, an output port, at least one circuit element and at least three resonators. The at least one electromagnetic LC filter circuit is electrically connected to the at least one acoustic wave resonance unit, and the at least three resonators include at least one first resonator and at least one second resonator. In a case where the at least one first resonator includes one first resonator, the first resonator is connected in series between the input port and the output port.

Bandpass filter circuit and multiplexer

Provided is an inductor stack structure. The inductor stack structure include a substrate; at least two metal layers sequentially stacked on one side of the substrate, each metal layer at least comprises a first plane inductor; a through hole, which is located between any two neighboring metal layers, first plane inductors in different metal layers are electrically connected through the through hole; and a thickness of the through hole is greater than that of the metal layer.

Inductor stack structure

The module structure includes a substrate, a passive element, metal columns and a chip. The passive element, the metal columns and the chip are located on a same side of the substrate. The passive element is located between the substrate and the film where the metal columns and the chip are located. The following applies: the vertical projection of the chip on the substrate overlaps a line segment or closed figure formed by endpoints constituted by the vertical projections of the metal columns on the substrate; the vertical projection of the passive element on the substrate overlaps the line segment or closed figure formed by the endpoints constituted by the vertical projections of the metal columns on the substrate; or the vertical projection of the passive element on the substrate overlaps the vertical projection of the chip on the substrate.

Module structure and method for manufacturing the module structure

Provided is an integrated circuit and a test method for an integrated circuit. The integrated circuit includes at least one first branch and at least one second branch. The first branch includes at least one first capacitor. The first end of the first branch is electrically connected to the first end of the second branch, and the second end of the first branch is not connected to the second end of the second branch, to conduct a low-frequency test. The low-frequency test includes application of a low-frequency test signal between the first end of the first branch and the second end of the first branch to test the first branch.

Integrated circuit and test method for integrated circuit

Provided is a frequency multiplexer. The frequency multiplexer includes a stacked structure. The stacked structure includes at least one insulating layer and a plurality of metal layers arranged alternately along a stacked direction. The stacked structure forms at least one first inductive element and at least one capacitive element. At least two of the plurality of metal layers are provided with respective first patterned metal structures. The first patterned metal structures in the at least two of the plurality of metal layers are electrically connected to form a first multilayer planar spiral coil structure. The first multilayer planar spiral coil structure constitutes the first inductive element.

Growing community of inventors

Anhui, China

Chengjie Zuo