Liquid X Printed Metals, Inc.

Chengeto Gwengo

Christianna M Petrak

Robert G Swisher

Described herein are adhesive gold inks, and methods for making and depositing these inks to form conductive traces. The adhesive gold inks generally contain a gold complex dissolved in a mixed solvent system including at least a diol and an amine. The mixed solvent system may further include a thioalkyldiol. The gold complex includes a first ligand and a second ligand. The first ligand may be a thioether, a phosphine, or an amine that volatilizes upon heating at a temperature of 200&#xb0; C. or less. The second ligand may be a halide or a carboxylate. The adhesive gold inks are clear and particle-free and may be formulated for deposition by a wide range of printing methods on both flexible and non-flexible substrates.

Particle-free adhesive gold inks

Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30&#xb0; C. to 90&#xb0; C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10&#x3a9;/&#x25a1;, or even less than 1&#x3a9;/&#x25a1;.

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Beaver Falls, PA, United States of America

Chengeto Gwengo