Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Chengcheng Hou

Shancai Zhang

Yueyuan Zhang

Kun Li

Guanglei Yang

Zhaobo Jiang

Ming Hu

Dayu Zhang

Yifei Zhan

Jin Sha

Hengbin Li

Yansheng Hu

The present disclosure relates to an ultrasonic touch device and a method. The ultrasonic touch device is disposed at a periphery of a display area of an electronic equipment. The ultrasonic touch device includes an ultrasonic ranging module. The ultrasonic ranging module includes a plurality of ultrasonic ranging units detected. The ultrasonic touch device includes a first position determining unit configured to determine a distance between a touch object and the ultrasonic ranging module, and determine a position of the touch object in a first coordinate direction of the display area according to the distance. The ultrasonic touch device includes a second position determining unit configured to determine a position of the touch object in a second coordinate direction of the display area according to a position of an ultrasonic ranging unit that receives the reflected ultrasonic waves in the ultrasonic ranging module.

Ultrasonic touch device and MEl'hod, display device

A test device for a printed circuit board assembly is disclosed. The test device includes a test platform for securing a printed circuit board assembly to be tested and a positioning platform located above the test platform and for securing a plurality of test probes. The plurality of test probes are secured at the bottom of the positioning platform and the secured positions in the positioning platform thereof are adjustable to align the test points on the printed circuit board assembly to be tested.

Test device for printed circuit board assembly

A device for attachment of double-sided adhesive and a method for attachment of the double-sided adhesive are provided. The device includes a driver, a platform and a robot arm provided above the platform. The robot arm is connected with the driver and configured to, under the driving of the driver, place the double-sided adhesive onto a preset position of the platform, strip off the first protective film of the double-sided adhesive at the preset position, press the printed circuit board assembly (PCBA) at the preset position against the double-sided adhesive without the first protective film, and unload the PCBA attached with the double-sided adhesive from the preset position. A positioning structure is provided at the preset position and configured to secure the adhesive layer and the second protective film when the robot arm strips off the first protective film, and release the securing of the adhesive layer and the second protective film when the double-sided adhesive is attached to the PCBA.

Double-sided adhesive attaching device and method for attachment of the double-sided adhesive

A testing device is disclosed. The testing device includes: a testing platform; an electromagnetic relay platform arranged opposite to the testing platform; and a plurality of probe assemblies disposed between the electromagnetic relay platform and the testing platform. Each of the probe assemblies includes an electromagnetic base and a probe mounted in a side of the electromagnetic base away from the electromagnetic relay platform. Each of the electromagnetic bases is attracted together with the electromagnetic relay platform under an electromagnetic attraction force when the electromagnetic relay platform is energized. The above testing device may be used for testing a variety of circuit boards, and has a relatively wide application.

Testing device

Growing community of inventors

Beijing, China

Chengcheng Hou