Hangzhou Mo-link Technology Co. Ltd

Cheng Zhi Mo

Hao Wang

Qi Chen

Hai Tang Qin

Fengfeng Yang

The present disclosure describes a signal transmission device based on molded interconnect device and laser direct structuring (MID/LDS) technology, comprising: a shielding shell (); and a photoelectric conversion module (), which includes a carrier (), an electrical module () and an optical module (). The photoelectric conversion module () is fixed inside the shielding shell (), wherein the first recessed structure () accommodates a driving chip (), a photoelectric conversion chip () and an optical module (), and the second recessed structure () accommodates an electrical module (), the driving chip (), the photoelectric conversion chip () and the conductive terminal () are electrically connected to each other, and the carrier () is designed by integral molding based on the MID/LDS technology. In t present disclosure, the design space in the shielding shell can be effectively saved.

Signal transmission device based on MID/LDS technology and assembly method thereof

An ultra-thin board-to-board photoelectric conversion device includes: a plug arranged at one end of an optical fiber; a socket on which the plug is arranged; a retaining element arranged to retain the plug in the socket; and a first circuit substrate on which the socket is mounted. The plug includes: a second circuit substrate; and a photoelectric chip, a lens for transmitting and processing light beams between the optical fiber and the photoelectric chip and a gold finger arranged on the second circuit substrate. The socket includes: a socket main body; and a hollow part for accommodating the lens and the photoelectric chip, an elastic sheet electrode extending from top of the socket main body to bottom of the socket main body and a casing arranged on the socket main body extending from an outer circumference of the socket main body to the top of the socket main body.

Ultra-thin board-to-board photoelectric conversion device

A pluggable free-space photoelectric hybrid connector including a female connector and a male connector is provided. The female connector includes a first insulating substrate, metal elastic clips, a first circuit board, and a first optical communication module. An insertion cavity is formed at the front end of the first insulating substrate, and a first fiber mounting hole and first electrode mounting holes are formed at the rear end thereof. The metal elastic clips are mounted in the first electrode mounting holes respectively, where contact portions of at least one set of metal elastic clips are exposed from the top of the insertion cavity, and contact portions of at least another set of metal elastic clips are exposed from the bottom of the insertion cavity. The first circuit board is mounted at the rear end of the first insulating substrate and is electrically connected to the metal elastic clips.

Growing community of inventors

Hangzhou, China

Cheng Zhi Mo