Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng Yu Wu

Tzung-Chen Wu

Tzu Wei Yu

Yuan-Yen Lo

Yu-Ling Tseng

Pei-Kao Li

Kai-Lun Tseng

In semiconductor manufacturing, deionized (DI) water or another process fluid is flowed through a nonmetallic pipe and onto a semiconductor wafer. Static electric charge is discharged from the DI water or other process fluid flowing through the nonmetallic pipe via an electrically conductive material disposed on an outside of the nonmetallic pipe. The electrically conductive material disposed on the outside of the nonmetallic pipe is electrically grounded. The nonmetallic pipe may comprise fluoropolymer (PFA) based tubing. In some embodiments, the nonmetallic pipe includes: a PFA-NE pipe connected with a chamber or housing containing the wafer, and a second pipe connected with the PFA-NE pipe by a pipe connector, in which the second pipe is more electrically insulating than the PFA-NE pipe.

Surface charge release in lithography developing process

A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location, and unloading the wafer from the robot arm.

Semiconductor tool with a shield

Growing community of inventors

Tainan, Taiwan

Cheng Yu Wu