Industrial Technology Research Institute

Cheng-Yu Peng

Chun-Heng Chen

Cho-Fan Hsieh

Teng-Chun Wu

Lee-May Huang

Yu-Tai Li

Wen-Chung Liang

Kao-Chi Lin

Chao-Ping Huang

Shang-Yeh Wen

A measuring method includes the following. An image to be tested of an object to be tested with a first characteristic pattern is formed and is copied to form multiple images to be tested. The multiple images to be tested are superimposed to form a to-be-tested overlapped image which has the multiple first characteristic patterns. A reference image of a reference object with a second characteristic pattern is formed and is copied to form multiple reference images. The multiple reference images are superimposed to form a reference overlapped image which has the multiple second characteristic patterns. The to-be-tested overlapped image and the reference overlapped image are superimposed to generate a virtual moir&#xe9; image having a moir&#xe9; pattern different from the multiple first characteristic patterns and the multiple second characteristic patterns.

Measuring method

A photovoltaic module is provided, and a cell set thereof includes a first cell, a second cell, and a conductive connection element. In the first cell, a first semiconductor stack has a first surface, a second surface, and a first side surface. A first electrode is disposed on the first surface. A second electrode is disposed on the second surface. In the second cell, a second semiconductor stack has a third surface, a fourth surface, and a second side surface. A third electrode is disposed on the third surface. A fourth electrode is disposed on the fourth surface. The conductive connection element connects the first electrode with a part of a first insulation layer on the second surface, and connects the third electrode with a part of a second insulation layer on the fourth surface.

Photovoltaic module

An encapsulant material with enhanced light reflectivity, a crystalline silicon photovoltaic module and a thin film photovoltaic module are provided. The encapsulant material has a porous structure therein, and an average pore diameter of the porous structure is between several hundreds of nanometers and several hundreds of micrometers, so that the light reflectance of the encapsulant material is improved. Moreover, the encapsulant material is crosslinked by a physical or chemical crosslinking method, so heat resistance thereof is improved. Therefore, the encapsulant material is suitable for the crystalline silicon photovoltaic module and the thin film photovoltaic module, so as to increase power conversion efficiency of these modules.

Encapsulant material, crystalline silicon photovoltaic module and thin film photovoltaic module

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Taoyuan, Taiwan

Cheng-Yu Peng