Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Cheng-yi Yang

Biao Li

Ming-Jaan Ho

Ning Hou

Hao-Wen Zhong

Mei-Hua Huang

Qiang Song

Yao-Cai Li

Zu-Ai Li

Yan-qiong He

An anti-shake assembly with reduced size is disclosed which includes a circuit board, a photosensitive chip, and a magnetic component. The circuit board includes a first rigid board, a second rigid board, a plurality of connectors, and a plurality of coils. The first rigid board has a housing space. The second rigid board is movably housed in the housing space. The connectors are flexibly connected between the first rigid board and the second rigid board. The photosensitive chip and the coils are provided on the second rigid board. The magnetic component includes a base and a plurality of magnets. The base includes a central plate and a side plate. The side plate is arranged around a periphery of the central plate to form a housing space. The magnets are provided on the central plate facing the housing space. The magnets are arranged opposite to the coils.

Anti-shake assembly and manufacturing method therefor, camera module with the anti-shake assembly

An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Embedded circuit board and manufacturing method thereof

An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

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Shenzhen, China

Cheng-yi Yang