Princo Middle East Fze

Mediatek Corporation

Siliconware Precision Industries Co., Ltd.

Mediatek Singapore Pte. Ltd.

Delta Optoelectronics, Inc.

Princo Corp.

Cheng-Yi Chang

Chih-kuang Yang

Chien-Ping Huang

Yongho Seok

Chih-Ming Huang

Hung-Tao Hsieh

Yeong-yan Guu

Gan-how Shaue

James Chih-Shi Yee

Lai-Cheng Chen

Jianhan Liu

Kai Ying Lu

Chien-Fang Hsu

Chang-Yueh Chan

Ying-You Lin

Kuang-Lung Tsai

Kuan-I Li

Yui-Shin Fran

Chi-Pin Kuo

Chih-Fang Chen

Ruey-Feng Jean

Yu-Hsien Chang

Chao-Wen Chou

Shih-Hsien Lin

Chun-Chien Chen

Po-Hsun Wei

Chin-Chi Chang

Chien-Chung Wu

Ying-Che Shih

Tse-Wen Chang

Jui-Hsia Chen

Jer-Shien Yang

Shien-Tsung Chiang

Ping-Chen Lin

Kun-Sheng Huang

Po-Yuen Cheng

A control method employed by a wireless fidelity (Wi-Fi) multi-link device (MLD) includes: in response to gaining access of a first link at a first time point through channel contention, enabling a multi-link coherent operation mode on the first link for performing frame exchange process on the first link by using N spatial streams, wherein N is a positive integer not smaller than 2; and in response to gaining access of a second link at a second time point through channel contention, blocking the multi-link coherent operation mode from being enabled on the second link, wherein performance of the second link is lower than performance of the first link.

Control method employed by wireless fidelity multi-link device for dealing with multi-link coherent operation

An access point (AP) and a station (STA) communicate with each other, with the AP indicating to the STA either or both of a preamble detection (PD) channel and a signaling (SIG) content channel and with the STA being initially monitoring a primary frequency segment of a plurality of frequency segments in an operating bandwidth of the AP. A downlink (DL) or triggered uplink (UL) communication is performed between the AP and the STA during a transmission opportunity (TXOP) such that: (i) during the TXOP, the STA monitors a preamble on the PD channel and decodes a SIG content on the SIG content channel; and (ii) after an end of the TXOP, the STA switches to the primary frequency segment.

Wide bandwidth transmission schemes

A non-access point (non-AP) station (STA) multi-link device (MLD) receives a transmission from an access point (AP) MLD. In response to receiving the transmission, the non-AP STA MLD communicates with the AP MLD using an increased number of spatial streams with multi-link dynamic antenna switching at the non-AP STA MLD.

Extreme-high-throughput multi-link dynamic antenna switching in wireless communications

One wireless communication device includes a transmitter circuit and a control circuit, wherein the control circuit sets a request to send (RTS) frame, and controls the transmitter circuit to transmit the RTS frame via at least one channel excluding a preamble punctured channel. Another wireless communication device includes a transmitter circuit and a control circuit, wherein the control circuit sets an RTS frame, and controls the transmitter circuit to transmit the RTS frame via a plurality of channels including the preamble punctured channel.

Method and apparatus of setting protection frames for protecting transmission of preamble punctured physical layer protocol data unit

A multi-link device (MLD) includes a transmit (TX) circuit, a receive (RX) circuit, and a control circuit. The control circuit controls the RX circuit to receive a first frame under an operation mode parameter with a first setting, control the TX circuit to transmit a second frame responsive to the first frame under the operation mode parameter with the first setting, and after the second frame is transmitted, controls the RX circuit to receive at least one physical layer protocol data unit (PPDU) under the operation mode parameter with a second setting, wherein the second setting is different from the first setting.

Wireless fidelity multi-link device with dynamic operation mode switch and associated method

A multi-user downlink orthogonal frequency-division multiple access (OFDMA) configuration method includes: assigning contiguous resource units (RUs) included in a channel to a plurality of stations, respectively; and assigning, by an access point (AP), one modulation and coding scheme (MCS) to each of the plurality of stations. Data rates of modulation and coding schemes that are assigned to first stations and associated with contiguous first RUs assigned to the first stations are monotonic, where the first stations are included in the plurality of stations.

Multi-user downlink orthogonal frequency-division multiple access configuration method

A smart wristwatch structure includes a glass, a dial, a watch case, a bottom case, a movement, an antenna, a functional module, and a dedicated battery. The dial, the watch case, and the bottom case construct an accommodating space from top to bottom. The antenna is adhered to a lower surface of the glass. The functional module is disposed in the accommodating space for wirelessly communicating with a mobile terminal. The dedicated battery provides power for the functional module or the movement. In the smart wristwatch structure, signals are not shielded, and the thickness of the watch case is not increased significantly.

Smart wristwatch structure

Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.

Electrical system and core module thereof

The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.

Wristwatch structure, electronic core for wristwatch, and method for manufacturing wristwatch

The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.

Wristwatch structure, electronic crown for wristwatch, and wristwatch having display

Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.

Multi-layer substrate and manufacturing method thereof

Method of manufacturing a multi-layer substrate

A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.

Sensor-type semiconductor package and fabrication method thereof

A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically connected to the substrate through the circuit layer and the transparent cover is exposed from the dielectric layer such that light can pass through the transparent cover to reach a sensor region of the sensor chip and allow the sensor chip to operate; and implanting a plurality of solder balls on another surface of the substrate to electrically connect the sensor chip to an external device. The sensor semiconductor device can be cost-effectively fabricated, and the circuit cracking and known good die (KGD) problems of the prior art can be avoided.

Sensor semiconductor device and fabrication method of the sensor semiconductor device

A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.

Sensor semiconductor device with sensor chip

Growing community of inventors

Hsinchu, Taiwan

Cheng-Yi Chang