Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Agilent Technologies, Inc.

Avago Technologies General IP (singapore) Pte. Ltd.

Aptina Imaging Corporation

Intellectual Discovery Co., Ltd.

Avago Technologies Ecbu IP Pte. Ltd.

Cheng Why Tan

Kee Yean Ng

Yee Loong Chin

Yew Cheong Kuan

Kong Weng Lee

Gin Ghee Tan

Huck Khim Koay

Weng Fei Wong

Chee Keong Chong

Seong Choon Lim

Ji Kin Tham

Siang Leong Foo

Gurbir Singh

Boon Kheng Lee

Wee Jin Yeap

Kee Siang Goh

Saiful Bahari Bin Saidan

Sundar A/l Natarajan Yoganandan

Beng Huat Low

Kee Y An Ng

Piang Joon Seow

Gurbir Singh A/l Balwant Singh

Sundar A L Natarajan Yoganandan

Teong Swee Tan

Premkumar S Ramachandr

A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

Semiconductor device with a light emitting semiconductor die

A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.

Methods for packaging an image sensor and a packaged image sensor

A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.

High power light emitting diode device

A reflection-based optical encoding apparatus for the detection of position and/or motion of a mechanical device includes an encoding medium having at least a first reflective portion, and an encoder housing having a light-emitting source and a light-detecting sensor embedded within, the encoder housing being placed in proximity to the encoding medium such that a functional light path can be established from the light-emitting source to the light-detecting sensor via the first reflective portion of the encoding medium. The encoder housing includes a first flat facet positioned between the light-emitting source and the encoding medium, the first flat facet having a first angle relative to a common geometric plane such that light passing from the light-emitting source to the encoding medium is refracted along a first angled path in a manner that the refracted light strikes a desired location of the encoding medium.

Flat-top reflection-based optical encoders

An encoder having a code strip and an emitter-detector module is disclosed. The code strip includes alternating reflective and opaque stripes. The emitter-detector module includes a housing, a lens insert, a light source and a photodetector. Light from the light source illuminates the code strip, and light reflected from the code strip is incident on the photodetector. The lens insert includes a lens that processes light generated by the light source either before the light reaches the code strip or after the light is reflected from the code strip. The lens insert mates with the housing to position the lens at a predetermined point relative to the light source or the photodetector. The housing will accept a plurality of lens inserts, each lens insert having a different lens from the others of the lens inserts.

Reflective encoder with interchangable lens on emitter-detector module

Optical encoders having one or more of a number of disclosed features are disclosed. The features of the optical encoder in accordance with the present invention include a symmetrical (for example, circular) emitter; baffle between the emitter and a detector; double-dome or single-dome encapsulant; multiple detector; and multiple (at least three) data channels.

Reflective encoders with various emitter-detector configurations

A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same

The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Packaging device for semiconductor die, semiconductor device incorporating same and method of making same

A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.

Encapsulating brittle substrates using transfer molding

The light-emitting device includes a light source and a gradient index (GRIN) element. The GRIN element has a cylindrical refractive index profile in which the refractive index varies radially and is substantially constant axially. The GRIN element includes a first end surface opposite a second end surface and is characterized by a length-to-pitch ratio. The GRIN element is arranged with the first end surface adjacent the light source to receive light from the light source, and emits the light from the second end surface in a radiation pattern dependent on the length-to-pitch ratio. Since the radiation pattern depends on the length-to-pitch ratio of the GRIN element, LEDs with different radiation patterns can be made simply by using GRIN elements of appropriate lengths.

Light-emitting diode incorporating gradient index element

A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting sites. The insulating substrate has at least one aperture providing access between a second side of the insulating substrate and the one or more mounting sites. The insulating substrate has one or more signal paths on the second side that couple the one or more apertures to one or more contact sites disposed about the insulating substrate. A series of conductive tabs is coupled to corresponding contact sites.

Physically compact device package

A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.

Light source

A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect. Each die, interconnect and lead pair are then separated to form individual LEDs.

Growing community of inventors

Penang, Malaysia

Cheng Why Tan