Foxconn Interconnect Technology Limited

Cheng-Wen Chen

Shun-Jung Chuang

Ke-Hao Chen

Chin-Yu Chen

Chiang-Nan Hung

A multi-layer circuit member includes: a first layer formed of a conductive material, the first layer including plural signal pads and a first reference plane spaced apart from the signal pads, the first reference plane including an outer region surrounding the signal pads and an inner region separating the plurality of signal pads; a second layer formed of a conductive material, the second layer including plural signal conductors and a second reference plane spaced apart from the signal conductors, the second reference plane including an outer region surrounding the signal conductors and an inner region separating the signal conductors; a ground layer disposed at a side of the second layer opposite from the first layer; plural dielectric layers separating the first layer, the second layer, and the ground layer.

Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads

An electrical connector includes an insulative housing and a number of contacts received in the insulative housing. The contact includes a first body and a second body extending from the first body. A first protrusion portion is formed by drawing the first body and a second protrusion portion is formed by stamping the second body. The first projecting portion and the second projecting are insert molded in the contact, therefore the contact has a larger intensity.

Growing community of inventors

Taipei, Taiwan

Cheng-Wen Chen