Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng Wei Sun

Li-Jui Chen

Heng-Hsin Liu

Shao-Hua Wang

Yi-Fam Shiu

Chueh-Chi Kuo

Zong-You Yang

Kueilin Ho

Chih-Chun Chiang

Some implementations described herein include operating components in a lithography system at variable speeds to reduce, minimize, and/or prevent particle generation due to rubbing of or collision between contact parts of the components. In some implementations, a component in a path of transfer of a semiconductor substrate in the lithography system is operated at a relatively high movement speed through a first portion of an actuation operation, and is operated at a reduced movement speed (e.g., a movement speed that is less than the high movement speed) through a second portion of the actuation operation in which contact parts of the component are to interact. The reduced movement speed reduces the likelihood of particle generation and/or release from the contact parts when the contact parts interact, while the high movement speed provides a high semiconductor substrate throughput in the lithography system.

Semiconductor processing tool and methods of operation

Growing community of inventors

Hsinchu, Taiwan

Cheng Wei Sun