Innolux Corporation

Cheng-Wei Liu

Fang-Cheng Jhou

Cheng-Chun Zhou

An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; providing an adhesive member between the first substrate and the second substrate; providing a first curved element and a second curved element opposite to the first curved element; arranging the second substrate on a curved top surface of the second curved element; arranging the first substrate between the first curved element and the second substrate; and pressurizing the first curved element and the second curved element, so that the first substrate and the second substrate are attached to each other through the adhesive member, thereby forming a curved composite component; wherein the first substrate is flat before the step of pressurizing the first curved element and the second curved element, and the first substrate becomes curved after the step of pressurizing the first curved element and the second curved element.

Manufacturing method of electronic device

An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.

Growing community of inventors

Miao-Li County, Taiwan

Cheng-Wei Liu