Lanxide Technology Company, LP

Cheng-Tsin Lee

Marc S Newkirk

Michael K Aghajanian

Danny R White

Christopher R Kennedy

Alan S Nagelberg

John T Burke

Michael A Rocazella

Robert J Wiener

Steven D Keck

Peter M Engelgau

The present invention relates to the formation of a macrocomposite body by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body and/or a metal or metal containing body. Particularly, an infiltration enhancer and/or infiltration enhancer precursor and/or infiltrating atmosphere are in communication with a filler material or a preform, at least at some point during the process, which permits molten matrix metal to spontaneously infiltrate the filler material or preform. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform, the infiltrated material is bonded to the second material, thereby forming a sealable electronic package.

Method of forming electronic packages

Growing community of inventors

Newark, DE, United States of America

Cheng-Tsin Lee