Sagatek Co., Ltd.

Cheng-Szu Chen

Jung-Hsiang Chen

Bo-Ting Chen

Kelvin Yi-Tse Lai

Shu-Yi Weng

A micro-electromechanical apparatus having a signal attenuation-proof function, and a manufacturing method and a signal attenuation-proof method thereof are disclosed. The micro-electromechanical apparatus includes a substrate, an insulation layer, and a sensing unit. The substrate has a doped region in which a majority of conductive carriers have the same polarity as an electronic signal. The insulation layer is located on the substrate, and the sensing unit is located above the insulation layer and forms the electronic signal when sensing a force.

Micro-electromechanical apparatus having signal attenuation-proof function, and manufacturing method and signal attenuation-proof method thereof

The present invention relates to a liquid multilayer capacitive micro inclinometer, comprising at least two pairs of differential electrodes, each pair positioned in a same plane; at least one common electrode with a portion positioned in the plane of each pair of differential electrodes. The differential electrodes and the common electrode are provided in a sealed chamber, in which an immersing liquid is filled. The shape of the differential electrodes forms a sector of a circular plane. The inclinometer may further integrate a reading circuit. The present invention also discloses preparation method for the invented inclinometer.

Multilayered liquid capacitive micro inclinometer

The present invention relates to a liquid capacitive micro inclinometer, comprising a pair of differential electrodes and a common electrode, all formed in the same plane in a sealed chamber. Immersing liquid is filled in the sealed chamber. The shape of the differential electrodes forms a sector of a circular plane. The inclinometer may further integrate a reading circuit. The present invention also discloses preparation method for the invented inclinometer.

Liquid capacitive micro inclinometer

The present invention discloses an adhesive-free method for preparation of micro electro-mechanical structure, comprising forming a micro electro-mechanical structure on a first substrate, forming an enclosing space for immersing liquid on the first or second substrate, and applying pressure to fix the first and second substrate. Before applying the pressure, the assembly including the two substrates is flipped, to make the contact surface immersed by the immersing liquid.

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Taipei, Taiwan

Cheng-Szu Chen