Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng-Pu Chiu

Chien-Hung Chen

Chien-Li Kuo

Li-Hsien Huang

Yao-Chun Chuang

Ting-Ting Kuo

Jun He

Chien-Chen Li

Embodiments provide metal features which dissipate heat generated from a laser drilling process for exposing dummy pads through a dielectric layer. Because the dummy pads are coupled to the metal features, the metal features act as a heat dissipation feature to pull heat from the dummy pad. As a result, reduction in heat is achieved at the dummy pad during the laser drilling process.

Heat dissipating features for laser drilling process

Growing community of inventors

Hsinchu, Taiwan

Cheng-Pu Chiu