Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng-Kuo Wen

Hsun-Chih Tsao

Yee-Chia Yeo

Chien-Chao Huang

Fu-Liang Yang

Kuang-Hsin Chen

Hao-Yu Chen

Di-Hong Lee

Tang-Xuan Zhong

A method for forming a substrate contact on a silicon-on-insulator (SOI) wafer is provided that can be integrated with a process for fabricating SOI devices without additional processing after wafer dicing. The method is applicable in many of the more advanced packaging technologies, e.g., such as flip chip and die stacking, directly creating a contact to silicon substrate via the front of the diced SOI wafer.

Method for forming SOI device

A method in which a gate and raised source/drain (S/D) regions are fully silicided in separate steps to avoid degrading the resistance or junction leakage is described. A gate dielectric layer, gate, and spacers are formed over a semiconductor layer that is preferably Si, SiGe, or SiGeC on a buried insulator. Raised S/D regions are formed by selective epitaxy between spacers and isolation regions. The gate is protected with a mask while the raised S/D regions are covered with a first metal layer. A first anneal affords fully silicided S/D regions. A dielectric stack is deposited on the substrate and planarized to be coplanar with the top of the spacers. The mask is removed and a second metal layer is deposited. A second anneal yields a fully silicided gate electrode. The invention is also an SOI transistor with silicided raised S/D regions and a fully silicided and optionally recessed gate.

Silicide gate transistors and method of manufacture

A semiconductor device formed on a semiconductor substrate and a method of forming the same. In one embodiment, the semiconductor device includes a gate over the semiconductor substrate and a dielectric liner on a sidewall of the gate. The semiconductor device also includes an extension spacer adjacent and extending laterally beyond the dielectric liner along the semiconductor substrate. The semiconductor device further includes a source/drain located below an upper surface of the semiconductor substrate and adjacent a channel region under the gate. The source/drain extends under the dielectric liner and the extension spacer. The semiconductor device still further includes a silicide region over a portion of the source/drain and extending laterally beyond the extension spacer along the semiconductor substrate. Thus, the extension spacer is interposed between the dielectric liner and the silicide region located over a portion of the source/drain.

Semiconductor device employing an extension spacer and a method of forming the same

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Hsinchu, Taiwan

Cheng-Kuo Wen