Foxconn Interconnect Technology Limited

Fuding Precision Components (shenzhen) Co., Ltd.

Cloud Light Technology Limited

Cheng-Kai Huang

Shuo-Hsiu Hsu

Shih-Wei Hsiao

Hsiu-Yuan Hsu

Jia-Hau Liu

Paul Chen

Wei-Chih Lin

Genn-Sheng Lee

Ming-Hsing Chung

Chih-Chung Hsieh

Chang-Hung Tien

Yen-Hsu Ko

Mao-Chun Weng

Wayne Chou

Bo-Hong Ma

A light receiving and emitting module includes a sub-mount platform, a photoelectrical conversion component, a lens and a base. The sub-mount platform is made of silicon-based material and has first and second contact surfaces. The photoelectrical conversion component is disposed on the first contact surface. The lens is disposed on the second contact surface. The sub-mount platform is disposed on one side of the base. The first contact surface and second contact surface have therebetween a height difference, such that the photoelectrical conversion component matches the center of the lens. Further provided is a light receiving and emitting device including the light receiving and emitting module, a printed circuit board and a plurality of conducting wires. The conducting wires are electrically connected to the photoelectrical conversion component and printed circuit board. The conducting wires are disposed on at least two sides of the light receiving and emitting module.

Light receiving and emitting device

A interconnection system includes a panel side kit and a wall-mount kit coupled with each other and secured together via magnetic forces. The wall-mount kit includes a printed circuit board enclosed within a bracket and defining a center region for power transmission and a pair of side regions for high speed transmission. In the side regions, on the coupling side a plurality of wireless transmission units are located while on the back side a plurality of ROSA OE modules are provided to transfer the optical signal from optical fibers to the electronic signal for wireless transmission wherein the optical fibers are linked to a control box via a plurality of TOSA EO modules. The panel side kit includes wireless receiving units that interact with the wireless transmission units, and a plurality of connectors with the body of the display.

Interconnection system with hybrid transmission

Growing community of inventors

Taipei, Taiwan

Cheng-Kai Huang