Siliconware Precision Industries Co., Ltd.

Cheng Kai Chang

Chia-Cheng Chen

Chang-Fu Lin

Wen-Jung Tsai

Don-Son Jiang

Jui-Feng Chen

Chia-Cheng Hsu

An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate. Therefore, the first electronic component can be designed as a System on a Chip (SoC) with a smaller size to improve the process yield.

Electronic package and manufacturing method thereof

An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.

Electronic package and method for fabricating the same

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Taichung, Taiwan

Cheng Kai Chang