Taiwan Semiconductor Manufacturing Comp. Ltd.

Industrial Technology Research Institute

Cheng Hung Tsai

Li-Jui Chen

Shang-Chieh Chien

Heng-Hsin Liu

Sheng-Kang Yu

Min Sheng Kao

Chia Hung Chiu

Wei-Shin Cheng

Cheng-Da Shaw

Chiung-Hung Wang

Shun-Tien Lee

Tzu-Jung Pan

Kun-Yi Shen

Shun Tien Lee

A method includes: depositing a mask layer over a substrate; directing first radiation reflected from a central collector section of a sectional collector of a lithography system toward the mask layer according to a pattern; directing second radiation reflected from a peripheral collector section of the sectional collector toward the mask layer according to the pattern, wherein the peripheral collector section is vertically separated from the central collector section by a gap; forming openings in the mask layer by removing first regions of the mask layer exposed to the first radiation and second regions of the mask layer exposed to the second radiation; and removing material of a layer underlying the mask layer exposed by the openings.

Lithography system and methods

An extreme ultraviolet (EUV) photolithography system includes a scanner that directs the EUV light onto an EUV reticle. The photolithography system includes one or more contamination reduction structures positioned within the scanner and configured to attract and decompose contaminant particles within the scanner. The contamination reduction structure includes a surface material that is highly electronegative.

System and method for detecting debris in a photolithography system

Methods and apparatuses for a lithography exposure process are described. The method includes irradiating a target droplet with a laser beam to create an extreme ultraviolet (EUV) light. The methods utilized and the apparatuses include two or more collectors for collecting the generated EUV light and reflecting the collected EUV light to a focal point of one of the collectors. In some embodiments, one of the two collectors includes a ring-shaped collector.

Radiation collector

An extreme ultraviolet (EUV) source includes a collector associated with the vessel. The extreme ultraviolet (EUV) source includes a plurality of vanes along walls of the vessel. Each vane includes a stacked vane segment, and the stacked vane segments for each vane are stacked in a direction of drainage of tin (Sn) in the vessel. The EUV source includes a thermal control system comprising a plurality of independently controllable heating elements, where a heating element is configured to provide localized control for heating of a vane segment of the stacked vane segments.

Semiconductor processing tool and methods of operation

A system for monitoring and controlling an EUV light source includes a first temperature sensor, a signal processor, and a process controller. The first temperature sensor includes a portion inserted into a space surrounded by a plurality of vanes through a vane of the plurality of vanes, and obtains an ambient temperature that decreases with time as a function of tin contamination coating on the inserted portion. The signal processor determines an excess tin debris deposition on the vane based on the obtained chamber ambient temperature. The process controller activates a vane cleaning action upon being informed of the excess tin debris deposition by the signal processor, thereby improving availability of the EUV light source tool and reducing risks of tin pollution on other tools such as a reticle.

EUV light source contamination monitoring system

An extreme ultra violet (EUV) light source apparatus includes a metal droplet generator, a collector mirror, an excitation laser inlet port for receiving an excitation laser, a first mirror configured to reflect the excitation laser that passes through a zone of excitation, and a second mirror configured to reflect the excitation laser reflected by the first mirror.

EUV lithography apparatus

Microwave heating of debris collecting vanes within the source vessel of a lithography apparatus is used to accomplish uniform temperature distribution in order to reduce fall-on contamination and formation of clogs on the inner and outer surfaces of the vanes.

Method and apparatus for mitigating tin debris

A light transceiver module is designed for electronic devices. It forms an electric connection with the electric connector of the electronic device. The light transceiver module contains a base, a light-emitting device for providing optical signals, a light-receiving device for receiving optical signals, and a main circuit board. The base supports the light-emitting device, the light-receiving device, and the main circuit board. The main circuit board has a pluggable electric connector for connections with the electric connector of the electronic device. The light transceiver module can be used to simplify and optimize the devices using it.

Light transceiver module

An optical transmission module comprising at least a photoelectric element, a printed circuit board and a flexible printed circuit board is provided. The flexible printed circuit board electrically connects the photoelectrical elements and the printed circuit board. At least a ground plane is formed on the flexible printed circuit board to reduce crosstalk and electromagnetic interference. Transmission lines and impedance formed on the flexible printed circuit board solve the problems of signal distortion and impedance mismatch. The flexible printed circuit board also serves as a flexible interface to solve prior problems of connection stress between the photoelectric element and the printed circuit board.

Growing community of inventors

Hsinchu, Taiwan

Cheng Hung Tsai