Lucent Technologies Inc.

At&t Bell Laboratories

Cheng-Hsuan Chen

King Lien Tai

Shu Yang

Avishay Katz

Ho S Chen

James C Phillips

Edith C Ong

Donald D Bacon

A solid includes crosslinked amphiphilic organosilicate precursors. The amphiphilic organosilicate precursors form a matrix with an array of micro-structures dispersed in the matrix.

Organosilicate materials with mesoscopic structures

Template-based methods fabricate organosilicate materials with mesoscopic structures. The methods include providing solutions of amphiphilic template molecules, mixing amphiphilic organosilicate precursors into the solutions to form mixtures, and evaporating solvent from the mixtures. The evaporation steps produce composites in which the amphiphilic organosilicate precursors have nontrivial mesoscopic structures.

A method for bonding one body to another, such as a laser device to a submount, uses a metallic layer composed of a Group VB metal, such as niobium, sandwiched between a non-metallic layer and solder layer formed by an approximate Au-Sn eutectic layer. Advantageously the Group VB layer is formed at a submount temperature of less than approximately 201.degree. C., advantageously less than approximately 125.degree. C., and preferably less than approximately 101.degree. C.--advantageously to a thickness in the approximate range 0.05 .mu.m to 0.2 .mu.m, or even thinner if pinholes do not develop. The non-metallic layer is located on one of the bodies, and the other body has a metallic coating advantageously capped with an Au layer.

Bonding scheme using group VB metallic layer

A method for enhancing linewidth control during the patterning of a substrate with a resist is disclosed. Resists used in the invention have chemically separated structures characterized by two types of regions of different chemical composition, which different types of regions are interspersed among each other. Because the resists used in the present invention have chemically separated structures, anisotropic wet development of these resists is achievable with an appropriate bicomponent wet developer. Consequently, after exposure, the image formed in a thin, upper layer of the resist is transferred with vertical walls through the thickness of the resist.

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New Providence, NJ, United States of America

Cheng-Hsuan Chen