Taiwan Semiconductor Manufacturing Comp. Ltd.

National Central University

Cheng-Hsien Wu

Chih-Hsin Ko

Clement Hsingjen Wann

I-Sheng Chen

Yi-Jing Lee

Chih Chieh Yeh

You-Ru Lin

Tzu-Chiang Chen

Xinyu Bao

Hengyuan Lee

Yee-Chia Yeo

Chien-Min Lee

Chih-Chieh Yeh

Cheng-Tien Wan

Chih-Sheng Chang

Hung-Li Chiang

Tung-Ying Lee

Shu-Han Chen

Elia Ambrosi

Chi-Wen Liu

Carlos H Diaz

Chao-Ching Cheng

Ling-Yen Yeh

Ying-Yu Chen

Yen-Ming Chen

Stefan Rusu

Tsung-Lin Lee

Liang-Yin Chen

Chan-Lon Yang

Xiong-Fei Yu

Yu-Lin Yang

Wilman Tsai

Ding-Kang Shih

Jung-Piao Chiu

Hao-Hsiung Lin

Szu-Wei Huang

Ta-Chun Ma

Hau-Yu Lin

Wei-Chieh Chen

Sai-Hooi Yeong

Bo-Feng Young

Yu-Sheng Chen

Chi-On Chui

Jen-Inn Chyi

Chen-Feng Hsu

Heng-Kuang Lin

Pei-Chin Chiu

Han-Chieh Ho

Tze-Liang Lee

Pang-Yen Tsai

Chung-Yi Lin

Yen-Sen Wang

Ji-Yin Tsai

Yao-Tsung Huang

Cheng-Chun Chang

Pei-Jer Tzeng

The present disclosure provides a FinFET device. The FinFET device comprises a semiconductor substrate of a first semiconductor material; a fin structure of the first semiconductor material overlying the semiconductor substrate, wherein the fin structure has a top surface of a first crystal plane orientation; a diamond-like shape structure of a second semiconductor material disposed over the top surface of the fin structure, wherein the diamond-like shape structure has at least one surface of a second crystal plane orientation; a gate structure disposed over the diamond-like shape structure, wherein the gate structure separates a source region and a drain region; and a channel region defined in the diamond-like shape structure between the source and drain regions.

FinFET device having a channel defined in a diamond-like shape semiconductor structure

Operating method, memory system, and control circuit are provided. The operating method is for operating a memory device comprising a selector and a memory element serially coupled to the selector. The operating method comprises presetting the memory device by providing a preset signal to the memory device, wherein the preset signal is clamped at a first current; and accessing the memory device by providing an access signal to the memory device, wherein a second current greater than the first current flows through the memory device when the access signal is provided to the memory device.

Operating method, memory system, and control circuit

A semiconductor device includes a fin extending from a substrate. The fin has a source/drain region and a channel region. The channel region includes a first semiconductor layer and a second semiconductor layer disposed over the first semiconductor layer and vertically separated from the first semiconductor layer by a spacing area. A high-k dielectric layer at least partially wraps around the first semiconductor layer and the second semiconductor layer. A metal layer is formed along opposing sidewalls of the high-k dielectric layer. The metal layer includes a first material. The spacing area is free of the first material.

Multi-gate device and method of fabrication thereof

A method includes applying a first voltage pulse across a memory cell, wherein the memory cell includes a selector, wherein the first voltage pulse switches the selector into an on-state; after applying the first voltage pulse, applying a second voltage pulse across the memory cell, wherein before applying the second voltage pulse the selector has a first voltage threshold, wherein after applying the second voltage pulse the selector has a second voltage threshold that is less than the first voltage threshold; and after applying the second voltage pulse, applying a third voltage pulse across the memory cell, wherein the third voltage pulse switches the selector into an on-state; wherein the selector remains continuously in an off-state between the first voltage pulse and the third voltage pulse.

Memory selector threshold voltage recovery

A device includes a channel layer, a gate structure, a first gate spacer, and a second gate spacer. The gate structure wraps around the channel layer. The first gate spacer and the second gate spacer are on opposite sides of the gate structure. The first gate spacer has a first portion and a second portion between the gate structure and the first portion of the first gate spacer, and a dopant concentration of the second portion of the first gate spacer is greater than a dopant concentration of the first portion of the first gate spacer.

Semiconductor device

An ovonic threshold switch (OTS) selector and a memory device including the OTS selector is provided. The OTS selector includes a switching layer formed of a GeCTe compound further doped with one or both of nitrogen and silicon, and exhibits improved thermal stability and electrical performance.

Memory device and manufacturing method thereof

First fire operations for an ovonic threshold switch (OTS) selector is provided. A first fire operation includes setting a peak amplitude of a voltage pulse, and performing at least one cycle, including: providing the voltage pulse to the OTS selector; sensing an output current passing through the OTS selector in response to the received voltage pulse; comparing a peak amplitude of the voltage pulse with a maximum peak amplitude ensuring initialization of the OTS selector; ending the first fire operation if the peak amplitude reaches the maximum peak amplitude; comparing the output current with a target current indicative of initialization of the OTS selector if the peak amplitude is lower than the maximum peak amplitude; ending the first fire operation if the output current reaches the target current; and setting another voltage pulse with a greater peak amplitude if the output current is lower than the target current.

First fire operation for ovonic threshold switch selector

A multi-gate semiconductor device includes a plurality of nanostructures vertically stacked over a substrate, a gate dielectric layer wrapping around the plurality of nanostructures, a gate conductive structure over the gate dielectric layer, and a first insulating spacer alongside the gate conductive structure and over the plurality of nanostructures. The first insulating spacer is in direct contact with the gate conductive structure and the gate dielectric layer.

Multi-gate semiconductor device and method for forming the same

A memory device includes a substrate, a transistor disposed over the substrate, an interconnect structure disposed over and electrically connected to the transistor, and a memory stack disposed between two adjacent metallization layers of the interconnect structure. The memory stack includes a bottom electrode disposed over the substrate and electrically connected to a bit line, a memory layer disposed over the bottom electrode, a selector layer disposed over the memory layer, and a top electrode disposed over the selector layer and electrically connected to a word line. Besides, at least one moisture-resistant layer is provided adjacent to and in physical contact with the selector layer, and the at least one moisture-resistant layer includes an amorphous material.

Memory devices and methods of forming the same

A control method to operate a memory device, a control method to operate a memory system and a control system are provided. The control method includes providing a first voltage to a memory device for accessing a memory element of the memory device; obtaining an aging information of the memory device; and providing a second voltage to the memory device according to the aging information, wherein the first voltage and the second voltage are reverse biased voltages.

Adjusting operation voltage of cross point memory according to aging information

A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

A semiconductor device includes a semiconductor substrate and an interconnection structure. The interconnection structure is disposed over the semiconductor substrate. The interconnection structure includes first conductive lines, second conductive lines, and ovonic threshold switches. The first conductive lines extend parallel to each other in a first direction. The second conductive lines are stacked over the first conductive lines and extend parallel to each other in a second direction perpendicular to the first direction. The ovonic threshold switches are disposed between the first conductive lines and the second conductive lines. The ovonic threshold switches include a ternary GeCTe material. The ternary GeCTe material consists substantially of carbon, germanium, and tellurium. In the ternary GeCTe material, a content of carbon is in a range from 10 to 30 atomic percent and a content of germanium is in a range from 10 to 65 atomic percent.

Semiconductor device and manufacturing method thereof

A method for forming a polycrystalline semiconductor layer includes forming a plurality of spacers over a dielectric layer, etching the dielectric layer using the plurality of spacers as an etch mask to form a recess in the dielectric layer, depositing an amorphous semiconductor layer over the plurality of spacers and the dielectric layer to fill the recess, and recrystallizing the amorphous semiconductor layer to form a polycrystalline semiconductor layer.

Methods for forming polycrystalline channel on dielectric films with controlled grain boundaries

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Hsinchu, Taiwan

Cheng-Hsien Wu