Unitech Printed Circuit Board Corporation

Cheng-Hsien Chou

Hung-Min Chen

Shun-Yueh Hsu

Kun-Chi Chen

A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.

Method of manufacturing a multilayer printed circuit board with a built-in electronic device

The present invention relates to a manufacturing method of rigid flexible printed circuit board. Inner layer circuit are etched on two side of a flexible basefilm and a flat cable for connecting the inner layer circuit on lateral sides is disposed on the middle part thereof. Then layer of outer copper foil without bondfilm made of reinforced fiber on the bottom side thereof is laminated on both sides of the flexible basefilm respectively and drilled a number of through holes on connecting points of preset circuitry thereof. Subsequently, each through hole is metalized and plated for electrically connecting outer copper foil and inner layer circuit on flexible basefilm by means of such plated layer. The copper foil on the top of the flat cable that is on the middle of the flexible basefilm is removed and out layer circuit is made on outer copper foil. At last, the outer layer circuit is covered by solder resist mask. In accordance with the fabricating process mentioned above, the cutting of redundant parts and the trouble of covering protective barrier on flat cable on the middle of the flexible basefilm could be avoided.

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Zhonghe, Taiwan

Cheng-Hsien Chou