Siliconware Precision Industries Co., Ltd.

Winbond Electronics Corporation

Cheng-Hsiang Liu

Hsin-Yi Liao

Hong-Da Chang

Shih-Kuang Chiu

Lu-Yi Chen

Chang-Lun Lu

Cheng-Yi Chen

Chun-Hung Lin

Chen-Han Lin

Meng-Hsien Tsai

Jun-Cheng Liao

Kuang-Wei Huang

Li-Chien Wang

A monitoring structure for a critical dimension of a lithography process including a dummy pattern layer and a patterned photoresist layer is provided. The dummy pattern layer includes a dummy pattern. The patterned photoresist layer includes at least one monitoring mark located above the dummy pattern. The monitoring mark includes a first portion and a second portion that intersect each other. The first portion extends in a first direction, the second portion extends in a second direction, and the first direction intersects the second direction.

Monitoring structure for critical dimension of lithography process

An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.

Electronic device

A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically connected to the ground pad; an encapsulant encapsulating the lid and the wire segment; and a circuit layer formed on the encapsulant and electrically connected to the wire segment and the lid so as to commonly ground the substrate and the lid, thereby releasing accumulated electric charges on the lid so as to improve the reliability of the MEMS system and reduce the number of I/O connections.

Package structure having micro-electro-mechanical system element and method of fabrication the same

A fabrication method of a package structure having MEMS elements includes: disposing a plate on top of a wafer having MEMS elements and second alignment keys; cutting the plate to form therein a plurality of openings exposing the second alignment keys; performing a wire bonding process and disposing block bodies corresponding to the second alignment keys, respectively; forming an encapsulant and partially removing the encapsulant and the block bodies from the top of the encapsulant; and aligning through the second alignment keys so as to form on the encapsulant a plurality of metal traces. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce the fabrication costs. Further, since the plate only covers the MEMS elements and the encapsulant is partially removed, the overall thickness and size of the package structure are reduced.

Method for fabricating package structure having MEMS elements

Growing community of inventors

Taichung, Taiwan

Cheng-Hsiang Liu