Advanced Semiconductor Engineering, Inc.

Cheng-Hsi Chuang

Meng-Jen Wang

Chi-Tsung Chiu

Hui-Ying Hsieh

Hui Hua Lee

A semiconductor device package includes a conductive base, and a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth. A semiconductor die is disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a second surface opposite the first surface. The second surface of the semiconductor die is bonded to the bottom surface of the cavity. A distance between the first surface of the semiconductor die and the first surface of the conductive base is about 20% of the depth of the cavity.

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Kaoshiung, Taiwan

Cheng-Hsi Chuang