Industrial Technology Research Institute

Cheng-Hong Lee

Hsin-Li Lee

Yi-Shiau Chen

A microelectronic 3-dimensional solenoid of substantially circular or oval cross-section and a method for fabricating the solenoid. The solenoid is provided including a pre-processed semiconductor substrate, two supports upstanding from and spaced-apart on a top surface of the substrate, each support has a bottom end attached to the substrate. An inductor coil which has two spaced-apart ends each attached to one of two top ends of the two supports. The inductor coil is formed of a bi-layer metal laminate that has an inner metal layer and an outer metal layer. The outer metal layer is formed of a first metal that has a coefficient of thermal expansion larger than a coefficient of thermal expansion of a second metal that forms the inner metal layer.

Microelectronic 3-D solenoid of circular cross-section and method for fabrication

A method for forming a cantilever beam probe card on a semiconducting substrate and the probe card fabricated by such method are described. The method utilizes the deposition of two separate metal layers of different metals for forming a cantilever beam and a microprobe for use as a probe needle. A sacrificial, insulating material layer such as oxide or nitride is utilized in-between the metal layers and a semiconducting substrate and is subsequently removed such that the cantilever beams are released from the semiconducting substrate except at a support portion. The present invention cantilever beam probe card formed by the method can be used to probe testing IC devices that have high pin count and fine pitch.

Method for forming cantilever beam probe card and probe card formed

A device for bump probing and a method for fabricating the device are described. The device utilizes a bimorph-structured fingers for holding onto a solder bump, or a solder ball, without causing damages to the ball. The device further utilizes a direct current to cause an electrostatic force to flatten the probe fingers prior to attaching the fingers to a solder ball and for positioning the finger over a solder ball. After the electrostatic force is removed by disconnecting the direct current from the electrodes, the fingers grip onto the solder ball making electrical connection and performing testing. The invention further provides a micro-electro-mechanical-system technique for fabricating the probing device on a semiconducting substrate.

Device for bump probing and method of fabrication

A tunable microelectronic capacitor and a tunable microelectronic inductor, each utilizing a micro-actuator fabricated by MEMS technique as a major component in the capacitor, the micro-actuator drives a dielectric plate in between to electrode plates to vary the capacitance. In the inductor, the micro-actuator drives a cantilever beam member made of a magnetic material into an inductor coil for changing the inductance of the coil.

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Shinjuang, Taiwan

Cheng-Hong Lee