Au Optronics Corporation

Cheng-He Ruan

Chih-Yuan Hou

Jian-Jhou Tseng

A display device includes a flexible substrate, a bonding pad, a light-emitting diode, an encapsulant, and a support structure. The bonding pad and the light-emitting diode are located on the flexible substrate. The encapsulant covers the light-emitting diode. The support structure is laterally located between the light-emitting diode and the bonding pad. The support structure has an inclined surface, and a thickness of the support structure close to the light-emitting diode is greater than the thickness of the support structure close to the bonding pad.

Display device and manufacturing method thereof

A display panel includes a substrate and display pixels. The display pixels are disposed on the substrate, and each of the display pixels includes pad sets, light-emitting devices, a first connecting wire, a second connecting wire, and first cutting regions. Each pad set has a first pad and a second pad. The light-emitting devices are electrically bonded to at least part of the pad sets. The first connecting wire is electrically connected to the first pads of a plurality of first pad sets of the pad sets. The second connecting wire is electrically connected to the second pads of the pad sets. The first cutting regions are disposed on one side of each of the first pad sets. Two first connecting portions of the first connecting wire and the second connecting wire connecting each of the first pad sets are located in one of the first cutting regions.

Display panel

A pixel structure includes a transmissive area and a reflective area. The pixel structure includes a first transparent electrode, a second transparent electrode, a reflective electrode, a first switching element, and a second switching element. The first transparent electrode has a first portion and a second portion connected to each other. The first portion is disposed in the reflective area, and the second portion is disposed in the transmissive area and is narrower than the first portion. The second transparent electrode is disposed in the transmissive area. The reflective electrode is stacked on the first portion of the first transparent electrode and is isolated from the second transparent electrode. The first switching element is disposed in the reflective area and is electrically connected to the first transparent electrode. The second switching element is disposed in the reflective area and is electrically connected to the second transparent electrode.

Pixel structure and display device

A method of manufacturing a display device includes the following steps. A bonding pad is formed on a dielectric layer. A light-shielding material is formed on the dielectric layer. A temperature of the light-shielding material is increased such that the light-shielding material is cured into a light-shielding layer. During curing the light-shielding material into the light-shielding layer, the light-shielding material flows to and contacts a portion of a surface of the bonding pad. A light-emitting element is electrically connected to the bonding pad.

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Hsin-Chu, Taiwan

Cheng-He Ruan