Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng-Fei Yu

Jiun-Rong Pai

Hsu-Shui Liu

Cheng-Kang Hu

Chang-Chen Tsao

Ting-Yau Shiu

An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

Growing community of inventors

Hsin-Chu, Taiwan

Cheng-Fei Yu