Bridge Semiconductor Corporation

Other

A.c.r. Tech Co., Ltd.

Pegatron Corporation

Huang; Yen-kun

Cheng-Chung Chen

Charles W C Lin

Ya-Yen Chou

Min-Yuan Yang

Shih-Hao Liao

Jheng-Hong Ciou

Cheng-Lien Chiang

Chia-Chung Wang

Wei-Chun Tsao

Cheng-Yi Liao

Chin Hock Tan

A benzoxazine resin, including a compound of the following Formula 1-1: where R, R, and Rare as defined herein.

Benzoxazine resin, composition thereof and copper clad laminate made thereof

A resin, including a compound having the following Formula 1-1: wherein n ranges from 1 to 5, and R1, R2, R3 and R4 are as defined herein.

Resin, composition thereof and copper clad laminate made thereof

A resin comprises at least one compound selected from one of the following formulas

Resin, copper clad laminate made of resin, and printed circuit board

An apartment staircase automatic lift, comprising a combined structure of a carrying guiding-rail, a transmission-set main-body and a driving module; wherein the transmission-set main-body is set with a carrying wheel-seat and a transmission-set carrying-shelf; wherein the transmission-set carrying-shelf is set with a foot-pedal; when a person stands on the foot-pedal, the driving module can be controlled to drive the transmission-set main-body and the foot-pedal to move back and forth along the carrying guiding-rail between the upper and lower ends of the carrying guiding-rail; thereby helping the person to go up and down the staircase. The overall structure has the advantages of low cost, easy installation and operation, and compact structure; which can improve the defects of the conventional staircase-lift seat including the large volume size, occupying large staircase space, and being inconvenient to be arranged in a general apartment staircase.

Apartment staircase automatic lift

An optical fiber connector configured for engaging with an external optical fiber connector includes a fiber core, a connector body, a coupling tube, and at least one coupling holder. The connector body has a first end portion and a second end portion, and the first end portion connects and fixes the fiber core. The second end portion is depressed inwardly to define a coupling space, and the external optical fiber connector is detachably plugged into the coupling space and coupled with the fiber core. The coupling tube is disposed in the connector body, and a portion of the coupling tube is located in the coupling space. One end portion of the fiber core is inserted in the coupling tube. The coupling holder is disposed in the coupling space, and corresponding to the coupling tube.

Optical fiber connector

A vehicular side view minor includes a minor seat having an engagement portion. A light-impermeable first annular wall protrudes rearwards from an inner periphery of a through-hole in the engagement portion. A minor is mounted in front of the minor seat and includes a reflective layer. A light-permeable housing is mounted to the engagement portion and has a second annular wall extending through the first annular wall. A front wall of the second annular wall includes an optical lens portion. A circuit board is received in the housing and has a lighting element. The circuit board includes a periphery abutting an abutment portion of the second annular wall. A gluing material is filled in a gluing space behind the circuit board and sealingly covers a rear surface of the circuit board, front sections of two wires, and a portion of the second annular wall to form a sealing portion.

Vehicular side view mirror including an illuminating device

A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, then etching the bumped terminal to expose the filler, then forming an insulative base, and then grinding the insulative base to expose the filler.

Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base

A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then forming an insulative base that covers a peripheral portion of the bumped terminal.

Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base

A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and an enlarged plated contact terminal, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, the metal pillar is welded to the routing line and includes a ball bond and a stem, and the plated contact terminal is plated on the stem.

Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal

The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.

Stackable semiconductor package having metal pin within through hole of package

A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative base. The routing line contacts the bumped terminal and the filler and extends laterally beyond the bumped terminal and the filler, the filler contacts the bumped terminal in a cavity that extends into the bumped terminal, and the insulative base contacts the routing line and the bumped terminal.

Semiconductor chip assembly with bumped terminal, filler and insulative base

A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line is adjacent to the bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then grinding the bumped terminal to expose the filler.

Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler

A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative base. The routing line contacts the filler and extends laterally beyond the filler, and the filler contacts the insulative base in an aperture that extends through the insulative base.

Semiconductor chip assembly with laterally aligned filler and insulative base

A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line contacts the bumped terminal and the filler and extends laterally beyond the bumped terminal and the filler, and the filler contacts the bumped terminal in a cavity that extends through the bumped terminal.

Semiconductor chip assembly with bumped terminal and filler

A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is adjacent to the bumped terminal and extends laterally beyond the bumped terminal and the filler, and the filler contacts the bumped terminal in a cavity that extends through the bumped terminal.

Growing community of inventors

Taipei, Taiwan

Cheng-Chung Chen