Mstar Semiconductor, Inc.

Lam Research Corporation

Cheng-Chieh Lin

Yao-Chi Wang

Chih-Ming Hung

Shih-Chieh Yen

Chung-Ho Huang

Jian-Yu Ding

Yueh-Ting Lee

A communication device is provided in the present invention. The communication device comprises an oscillation signal source, a tunable capacitor array, a frame counter; and a control module. The control module is configured to jointly or separately control the tunable capacitor array and the frame counter to compensate a first frequency offset of the oscillation signal source when the communication device operates in a first mode, and to jointly or separately control the tunable capacitor array and the frame counter to compensate a second frequency offset of the oscillation signal source when the communication device operates in a second mode.

Communication device and control method thereof

A phase locked loop and an associated alignment method are provided. A disclosed phase locked loop receives a reference signal to provide a feedback signal. The phase locked loop is first opened. When the phase locked loop is open, a frequency range of an oscillating signal from a voltage-controlled oscillator is substantially selected. The feedback signal is provided according to the oscillation signal. After the frequency range is selected, the phase locked loop is kept open and the phases of the reference signal and the feedback signal are substantially aligned. The phase locked loop is then closed after the reference signal and the feedback signal are aligned.

Phase locked loop and associated phase alignment method

A method of operating one or more back end circuits of a plasma processing system, comprising: prior to a front end module receiving one or more wafers to be processed, receiving preliminary data at a back end circuit, wherein the preliminary data indicates a recipe and a predetermined number, the predetermined number indicating a number of wafers to be processed; determining whether a plasma processing chamber is ready for processing; and if the chamber is ready for processing and via the back end circuit, selecting a load lock, based on the predetermined number, instructing the front end module to pull the one or more wafers into the load lock, enabling the chamber to process a first wafer of the one or more wafers according to the recipe, and subsequent to the processing of the first wafer, instructing the front end module to remove the first wafer from the chamber.

Methods and apparatus for integrating and controlling a plasma processing system

Growing community of inventors

Zhubei, Taiwan

Cheng-Chieh Lin