Tpk Touch Solutions Inc.

Asti Global Inc., Taiwan

Cheng-Chieh Chang

Chen-Yu Liu

Lu-Hsing Lee

Huai-San Ku

Chien-Shou Liao

Ching-Shan Lin

Shan-Yu Wu

Chih-Min Chen

Chien-Hsien Yu

Wei-Na Cao

Xue-Wei Wei

Zhi-Xiong Chen

A chip-detecting method, a chip-detecting structure and a chip-carrying structure are provided. The chip-detecting method includes providing a chip-detecting structure including a plurality of micro heater groups, a chip-carrying structure for carrying a plurality of chips, and a plurality of soldering material groups disposed between the chip-carrying structure and the chip-detecting structure; placing the chip-carrying structure and the chip-detecting structure adjacent to each other, so that each of the soldering material groups simultaneously contact the chip-carrying structure and the chip-detecting structure; respectively curing the low-temperature soldering material groups by heating of the micro heater groups, so that the chips are electrically connected to the chip-detecting structure respectively through the low-temperature soldering material groups that have been cured; and then detecting the chips so as to divide the chips into a plurality of good chips and a plurality of bad chips.

Chip-detecting method, chip-detecting structure and chip-carrying structure

A direct patterning method of touch panel is provided. A substrate having a display region and a peripheral region is provided. A periphery circuit having a bonding pad is disposed on the periphery region. A metal nanowire layer made of metal nanowires are disposed on the display region and the peripheral region. A photosensitive pre-cured layer is disposed on the metal nanowire layer. A photolithography process is performed, which includes exposing the pre-cured layer to define a removal area and a reserved area, and removing the pre-cured layer and the metal nanowire layer on the removal area using a developer solution to form a touch-sensing electrode disposed on the display region and to expose the bonding pad disposed on the periphery region. The touch sensing electrode made of the pre-cured layer and the metal nanowire layer is electrically connected to the periphery circuit.

Direct patterning method for a touch panel and touch panel thereof

A touch module and a manufacturing method thereof are disclosed. The touch module includes a substrate, at least one bridge, an active layer, at least two first touch electrodes, at least two second touch electrodes, and at least one electrode channel. The bridge is disposed on the substrate. The active layer overlays the bridge and the substrate. The first touch electrodes are embedded in the active layer and electrically touch the bridge, so that the first touch electrodes are electrically connected to each other via the bridge. The electrode channel is embedded in the active layer, and is configured to allow the second touch electrodes to be electrically connected to each other. The first touch electrodes are electrically isolated from the second touch electrodes.

Touch module and manufacturing method thereof

A touch module and a manufacturing method thereof are disclosed. The touch module includes a substrate, at least two first touch electrodes, at least two second touch electrodes, at least one conductive residual material, at least one electrode channel, and at least one bridge. The substrate has a first surface and a second surface. The first surface and the second surface are opposite to each other. The conductive residual material is formed on the second surface of the substrate. All of the first touch electrodes, the second touch electrodes, and the electrode channel are embedded in the substrate. The electrode channel is configured to electrically connect the second touch electrodes to each other. The bridge is disposed on the first surface of the substrate, and configured to electrically connect the first touch electrodes to each other. The first touch electrodes are isolated from the second touch electrodes.

The present invention relates to a touch sensing layer which comprises at least one first-axis sensing electrode, second-axis sensing electrode, insulating element and conductive bridge. Each first-axis sensing electrode comprises a plurality of first electrode patterns with discontinuity-in-series, and each second-axis sensing electrode is configured to interlace with each first-axis sensing electrode and comprises a plurality of second electrode patterns with continuity-in-series. Each insulating element is continuously formed on the corresponding second-axis sensing electrode, and each conductive bridge is also continuously formed above the corresponding first-axis sensing electrode and crosses the insulating element to connect those first electrode patterns with discontinuity-in-series.

Growing community of inventors

Taoyuan, Taiwan

Cheng-Chieh Chang