Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng-Chi Wu

Wen-Chuan Wang

Chien-Wen Chen

Rachid Salik

Shy-Jay Lin

Wen-Ju Preet Yang

Chin-Chang Hsu

Cheng-Hung Chen

Pei-Yi Liu

Jyuh-Fuh Lin

Jensen Yang

Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.

Integrated circuit layout validation using machine learning

A method includes obtaining a layout of a circuit pattern implemented on a semiconductor wafer, and identifying one or more polygons in the layout based on a length criteria. One or more measurement gauges are placed on the identified polygons to thereby obtain measured polygons. A scanning electron microscope (SEM) image of the circuit pattern is obtained. The SEM image is aligned with the layout including the measured polygons. A critical dimension of one or more objects in the SEM image is measured. The one or more objects correspond to the one or more polygons. Based on the measured critical dimension, it is determined whether the circuit pattern is acceptable.

Wafer-to-design image analysis (WDIA) system

A system and method for maskless direct write lithography are disclosed. The method includes receiving a plurality of pixels that represent an integrated circuit (IC) layout; identifying a first subset of the pixels that are suitable for a first compression method; and identifying a second subset of the pixels that are suitable for a second compression method. The method further includes compressing the first and second subset using the first and second compression method respectively, resulting in compressed data. The method further includes delivering the compressed data to a maskless direct writer for manufacturing a substrate. In embodiments, the first compression method uses a run-length encoding and the second compression method uses a dictionary-based encoding. Due to the hybrid compression method, the compressed data can be decompressed with a data rate expansion ratio sufficient for high-volume IC manufacturing.

System and method for maskless direct write lithography

A technique for converting design shapes into pixel values is provided. The technique may be used to control a direct-write or other lithographic process performed on a workpiece. In an exemplary embodiment, the method includes receiving, at a computing system, a design database specifying a feature having more than four vertices. The computing system also receives a pixel grid. A set of rectangles corresponding to the feature is determined, and the computing system determines an area of a pixel of the pixel grid overlapped by the feature based on the set of rectangles. In some such embodiments, a lithographic exposure intensity is determined for the pixel based on the area overlapped by the feature, and the lithographic exposure intensity is provided for patterning of a workpiece.

System and technique for rasterizing circuit layout data

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Hsinchu, Taiwan

Cheng-Chi Wu