Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng-Cheng Chang

Chih-Wei Chang

Chin-Kun Wang

Fa-Yuan Chang

Shih-Fang Chen

Cheng-Ting Tseng

Chin-Chang Chen

A wafer transfer system having a temperature control apparatus. The temperature control apparatus is constructed and arranged so that a material, element, or atomic particle may flow therethrough to heat or cool a wafer carried by the wafer transfer system. The material, element or atomic particle flowing through the temperature control apparatus causes heat to be pumped to or from an upper surface or lower surface. Preferably the temperature control apparatus is a thermoelectric device. Preferably the thermoelectric device includes a plurality of alternating N-type and P-type semiconductor pellets arranged electrically in series and thermally in parallel, and connected to a DC power supply. A switch or relay is provided for altering the direction of current flow to the thermoelectric device from a DC supply.

Wafer transfer system with temperature control apparatus

A gas discharge through nitrous oxide or nitrogen is used to remove polymeric deposits that form on the surface of a layer of a spin-on glass that was etched in an atmosphere of carbon-fluorine compounds. Removal of the polymeric deposit greatly improves adhesion to the spin-on glass layer of subsequently deposited layers. The removal is accomplished without increasing any tendency of the spin-on glass layer to absorb moisture.

Method for minimizing peeling at the surface of spin-on glasses

Growing community of inventors

Hsin-Chu, Taiwan

Cheng-Cheng Chang