Taiwan Semiconductor Manufacturing Comp. Ltd.

Chen-Yuan Hsia

Shih-Ming Chang

Wen-Chuan Wang

Chi-Lun Lu

Chang-Cheng Hung

Yen-Bin Huang

Ching-Yu Chang

Chin-Hsiang Lin

Hsin-Chang Lee

Chia-Jen Chen

Hong-Chang Hsieh

Kai-Chung Liu

A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.

System and method for removing particles in semiconductor manufacturing

A system and method are disclosed for monitoring a dimensional change of a pattern for an object having a transparent layer exposed through the pattern and a non-transparent pattern laminated therewith. According to the method, a first beam is projected to the pattern. A second beam resulted from the first beam passing through the transparent layer exposed by the pattern, or from the first beam reflected from the non-transparent layer of the pattern, is detected. A value of a predetermined property from the second beam detected is obtained. A variation of the value is monitored for identifying the dimensional change of the pattern.

Dimension monitoring method and system

Growing community of inventors

Hsin-Chu, Taiwan

Chen-Yuan Hsia