Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Chen Yuan

Yu Yang

Wei Zhou

Giseub Lim

Liang Yao

Chengnan Hsieh

Lin Huang

Cheng Nan Hsieh

Hong Shao

Weigang Peng

Erlun Chen

Liming Xu

A liquid knife cleaning apparatus and a liquid knife are provided. The liquid knife cleaning apparatus includes: a frame configured to be arranged on the liquid knife and be capable of reciprocating in an extending direction of the knife edge; a cleaning blade configured to extend into the knife edge of the liquid knife and be capable of reciprocating inside the knife edge under the driving of the frame to clean the knife edge, the cleaning blade being arranged on the frame; and a movable mechanism configured to control the frame to reciprocate on the liquid knife in the extending direction of the knife edge, the frame being connected to the movable mechanism.

Liquid knife, liquid knife cleaning apparatus and liquid knife assembly apparatus

A nozzle auto-cleaning device and a nozzle auto-cleaning method are disclosed. The nozzle auto-cleaning device includes a base and a cleaning piece feeding unit disposed on the base, the base has a bearing surface on which the cleaning piece feeding unit is disposed, the cleaning piece feeding unit is configured to transport a cleaning piece installed inside the nozzle auto-cleaning device along a first direction intersected with the bearing surface so that a first portion of the cleaning piece is protruded in a direction away from the bearing surface and inserted into a nozzle, and the base is configured to move along at least one direction of the first direction, as well as a second direction and a third direction intersected in a plane of the bearing surface, so as to drive the first portion of the cleaning piece to move inside the nozzle.

Nozzle auto-cleaning device and nozzle auto-cleaning method

Provided is a substrate processing apparatus, which comprises a processing chamber, a substrate sensing assembly, a rotation shaft and a driving assembly. A portion of the rotation shaft is provided inside the processing chamber and the remaining portion thereof is provided outside the processing chamber. The substrate sensing assembly is provided on the portion of the rotation shaft outside the processing chamber. The driving assembly is fixed at the portion of the rotation shaft inside the processing chamber. The driving assembly drives, when coming into contact with the substrate, the rotation shaft to rotate about its own axis along a first direction, and drives, when the substrate comes into no contact with the driving assembly, the rotation shaft to rotate about its axis along a second direction opposite to the first direction. The treatment liquid does not affect the substrate sensing assembly since it is provided outside the processing chamber.

Substrate processing apparatus

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Beijing, China

Chen Yuan