Elite Material Co., Ltd.

Elite Electronic Material (kunshan) Co., Ltd.

Other

Elite Electronics Material (kunshan) Co., Ltd.

Chen Yu Hsieh

Yan Zhang

Rongtao Wang

Ziqian Ma

Wenjun Tian

Wenfeng Lv

Provided are a modified polyphenylene ether resin, a method of making the same and a resin composition. Particularly, the modified polyphenylene ether resin has a structure represented by the following formula (I), wherein R, Y, PPE, Z and c are as described in the specification. Also provided are a method of making the modified polyphenylene ether resin, a resin composition comprising the modified polyphenylene ether resin and an article made from the resin composition. Using the modified polyphenylene ether resin described above can achieve a better glass transition temperature, thermal resistance and lower (superior) thermal expansion and dielectric properties.RY-PPE-Z]&#x2003;&#x2003; (I)

Modified polyphenylene ether resin, method of making the same and resin composition

The disclosure relates to a phosphorus-containing vinyl polyphenylene ether obtained by reacting a phosphorus-containing vinyl compound with a vinyl polyphenylene ether, a resin composition including the phosphorus-containing vinyl polyphenylene ether and a product thereof. Various products can be made from the resin composition, such as resin films, prepregs, resin-coated coppers, laminates or printed circuit boards, and they have one, multiple or all of the following properties: lower coefficient of thermal expansion, lower thermal expansion, higher thermal resistance, better flame retardancy, lower dielectric constant, lower dielectric loss and so forth.

Phosphorus-containing vinyl polyphenylene ether, resin composition comprising phosphorus-containing vinyl polyphenylene ether and product thereof

Disclosed is a fluorenylidene-diphenol-containing polyphenylene oxide which is defined by the following structural formula wherein D, X, Y, Z and b are defined in the specification. The fluorenylidene-diphenol-modified polyphenylene oxide resin or its prepolymer may be used for producing resin products with better thermal resistance, dielectric property, flame retardancy and lower thermal expansion. Accordingly, the resin products, such as prepregs, laminates or printed circuit boards, are suitable for use in electronic products with high speed and high frequency signal transmission to further improve the reliability, thermal resistance, and dimensional stability of the electronic products.

Fluorenylidene-diphenol-containing polyphenylene oxide

Cable protector

A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4'-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby

The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board.

Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same

An integrating system of a pressurized fluid generator and vortex separator comprises a pressurized fluid generator and a vortex separator. The pressurized fluid generator includes a high pressure tank which connects to a fluid storage tank and a pressure indicator through a pressure booster pump. A heating element and a temperature indicating controller are installed in the high pressure tank. The vortex separator is connected to the pressurized fluid generator through transfer pipes. The vortex separator includes a vortex separating tank. The vortex separating tank has an outlet at a bottom side thereof; the outlet is connected to a plurality of collection bottles. A spindle is located in the vortex separating tank and is driven by a driving device. The spindle is installed with a penetrating fluid channel which is connected to a plurality of transfer pipes; each of the transfer pipes is installed with a plurality of electric controlled switches.

Growing community of inventors

Taoyuan, Taiwan

Chen Yu Hsieh