Enthone Incorporated

Lucent Technologies Inc.

Nokia of America Corporation

Other

Alcatel Lucent

Macdermid Enthone Gmbh

Chen Xu

Joseph Anthony Abys

Chonglun Fan

Edward J Kudrak

Thomas B Richardson

Yung-Herng Yau

Karl F Wengenroth

Anthony Fiore

John Fudala

Jingye Li

Alan Blair

Brian T Smith

Bruce F Stacy

Flavio Pardo

Maria Elina Simon

Brijesh Vyas

Christian Rietmann

Jimmy Chun Wah Kwok

Michael L Ammerman

Thomas B c/o Enthone Inc Richardson

Joseph A c/o Enthone Inc Abys

Karl F c/o Enthone Inc Wengenroth

Yung-Herng c/o Enthone Inc Yau

John c/o Enthone Inc Fudala

Anthony c/o Enthone Inc Fiore

We disclose a circuit board that hosts at least first and second types of resistance sensors and a method of operating the same. The resistance of each sensor of the first type tends to increase, and the resistance of each sensor of the second type tends to decrease if the sensor is exposed to an aggressive environment. The circuit board also hosts a control circuit that operates to monitor respective resistances of the various resistance sensors and to process the digital values representing the resistances to estimate the working condition of one or more other electrical circuits located on the circuit board and/or in relatively close proximity to the circuit board in the corresponding equipment cabinet. The control circuit further operates to transmit out an appropriate alarm message if the estimated working condition is deemed unsatisfactory.

Detecting deterioration of an electrical circuit in an aggressive environment

We disclose a circuit board that hosts at least first and second types of resistance sensors. The resistance of each sensor of the first type tends to increase, and the resistance of each sensor of the second type tends to decrease if the sensor is exposed to an aggressive environment. The circuit board also hosts a control circuit that operates to monitor respective resistances of the various resistance sensors and to process the digital values representing the resistances to estimate the working condition of one or more other electrical circuits located on the circuit board and/or in relatively close proximity to the circuit board in the corresponding equipment cabinet. The control circuit further operates to transmit out an appropriate alarm message if the estimated working condition is deemed unsatisfactory.

Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.

Silver plating in electronics manufacture

A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.

Electrolytic deposition of metal-based composite coatings comprising nano-particles

There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.

Composite coatings for whisker reduction

A method comprising forming a structural elementon a surfaceof a layervia an electroless plating of nickel or cobaltonto the surface, the layer being rigidly fixed to an underlying substrate. The method also comprises etching away a portion of the layer such that a part of the structural element is able to move with respect to the substrate.

Electroless plating production of nickel and cobalt structures

In accordance with the invention, the quality of hard gold is determined by Raman vibrational spectroscopy. A sample of the hard gold is provided, a monochromatic light beam is directed onto the sample, and the frequency and intensity of the light scattered by the sample is analyzed for the vibrational frequencies of polymer molecules. Scattering frequencies offset from the initial beam frequency by about 2132 cm and about 2182 cm , for example, are indicative of high quality nickel-hardened gold.

Method of determining the quality of hard gold

A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

Multi-purpose finish for printed wiring boards and method of manufacture of such boards

Method of manufacture of printed wiring boards having multi-purpose finish

In accordance with the invention, a packaged electronic device comprises at least one electronic device and leads sealed within a protective package. The leads comprise a conductive metal substrate having a composite metal finish with a total thickness of 1000 &angst; or less. The finish comprises, in succession from the substrate, 25-750 &angst; of palladium alloy and 5-250 &angst; of wirebondable and solderable material. The substrate is advantageously nickel-plated copper alloy or Fe&mdash;Ni alloy. The content of palladium in the palladium alloy coating can range from 10-95 weight percent. This finish meets requirements of wirebonding and solderability at a thickness surprisingly lower than previously used packaging finishes.

Ultra-thin composite surface finish for electronic packaging

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New Providence, NJ, United States of America

Chen Xu