Siliconware Precision Industries Co., Ltd.

Chen-Wen Huang

Chih-Hsien Chiu

Fu-Tang Huang

Wen-Jung Tsai

Hsin-Lung Chung

Jia-Huei Hung

An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.

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Taichung, Taiwan

Chen-Wen Huang